Guide

32 Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide
Thermal Design Guidelines
The primary and secondary side volumetric constraints for the 2U thermal solution can be seen in
Section 2.1.2, “Motherboard Volumetric Constraint Requirements” on page 12. This thermal
solution is attached to the processor package with the use of spring loaded fasteners attached to a
backplate on the bottom side of PCB. The entire 2U assembly including backplate, PCB, Processor,
heatsink and fasteners can be seen in Figure 13. The same retention mechanism is used for both the
1U and 2U solutions.
Figure 13 illustrates z-height constraints of the 2U form factor. This mechanical stackup is based
on the Server System Infrastructure Specifications. These specifications may be viewed at
http://www.ssiforum.org.
Figure 13. 2U Thermal Solution Z-Height Constraints