Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Intel

Celeron

Processor on 0.13 Micron Process in the 478-Pin Package Datasheet 51

Package Mechanical Specifications

Package Mechanical Specifications 4

The Celeron processor on 0.13 micron process is packaged in a Flip-Chip Pin Grid Array

(FC-PGA2) package. Components of the package include an integrated heat spreader (IHS),

processor die, and the substrate that is the pin carrier. Mechanical specifications for the processor

are given in this section. See Section 1.1. for a listing of terminology. The processor socket that

accepts the Celeron processor on 0.13 micron process is referred to as a 478-Pin micro PGA

(mPGA478B) socket. See the Intel

Pentium

4 Processor 478-pin Socket (mPGA478B) Design

Guidelines for complete details on the mPGA478B socket.

Note: The following notes apply to Figure 27 through Figure 34:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. Figures and drawings labeled as “Reference Dimensions” are provided for informational

purposes only. Reference dimensions are extracted from the mechanical design database and

are nominal dimensions with no tolerance information applied. Reference dimensions are not

checked as part of the processor manufacturing process. Unless noted as such, dimensions in

parentheses without tolerances are reference dimensions.

3. Drawings are not to scale.

Note: Figure 27 is not to scale, and is for reference only. The socket and system board are supplied as a

reference only.

Figure 27. Exploded View of Processor Components on a System Board

stem board

mPGA478B

31 mm

Heat Spreader

Substrate

35mm square

3.5mm

2.0mm

478 pins

Socket