Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet 53
Package Mechanical Specifications
Figure 29 shows the keep-in specification for pin-side components. The Celeron processor on
0.13 micron process may contain pin side capacitors mounted to the processor package.
Figure 31 shows the flatness and tilt specifications for the IHS. Tilt is measured with the reference
datum set to the bottom of the processor substrate.
NOTES:
1. Pin plating consists of 0.2 micrometers Au over 2.0 micrometer Ni.
2. 0.254 mm diametric true position, pin-to-pin.
Figure 29. Processor Cross-Section and Keep-In
Figure 30. Processor Pin Detail
13.97mm
1.25mm
IHS
FCPGA
Component Keepin
Socket must allow clearance
for pin shoulders and mate
flush with this surface
Substrate
13.97mm
1.25mm
IHS
FCPGA
Component Keepin
Socket must allow clearance
for pin shoulders and mate
flush with this surface
Substrate
2
PINHEAD DIAMETER
Ø 0.65 MAX
KEEP OUT ZONE
Ø 1.032 MAX
2.03±0.08
SOLDER FILLET HEIGHT
0.3 MAX
ALL DIMENSIONS ARE IN MILIMETERS
Ø 0.305±0.025