Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

92 Intel

Celeron

Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Boxed Processor Specifications

8.2 Mechanical Specifications

8.2.1 Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed Celeron processor on

0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.

Figure 38 shows a mechanical representation of the boxed Celeron

processor on 0.13 micron

process.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The

physical space requirements and dimensions for the boxed processor with assembled fan heatsink

are shown in Figure 39 (Side Views), and Figure 40 (Top View). The airspace requirements for the

boxed processor fan heatsink must also be incorporated into new motherboard and system designs.

Airspace requirements are shown in Figure 43 and Figure 44. Note that some figures have center

lines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 39. Side View Space Requirements for the Boxed Processor