Intel Celeron D Processor 3xx Sequence

Datasheet 3
Contents
1 Introduction................................................................................................................11
1.1 Terminology.........................................................................................................11
1.1.1 Processor Packaging Terminology.........................................................12
1.2 References ..........................................................................................................13
2 Electrical Specifications........................................................................................15
2.1 FSB and GTLREF ...............................................................................................15
2.2 Power and Ground Pins ......................................................................................15
2.3 Decoupling Guidelines ........................................................................................15
2.3.1 V
CC
Decoupling......................................................................................16
2.3.2 FSB GTL+ Decoupling ...........................................................................16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................16
2.4 Voltage Identification...........................................................................................17
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18
2.5 Reserved, Unused, and TESTHI Pins.................................................................19
2.6 FSB Signal Groups..............................................................................................20
2.7 Asynchronous GTL+ Signals...............................................................................21
2.8 Test Access Port (TAP) Connection....................................................................21
2.9 FSB Frequency Select Signals (BSEL[1:0]) ........................................................22
2.10 Absolute Maximum and Minimum Ratings..........................................................22
2.11 Processor DC Specifications...............................................................................23
2.12 V
CC
Overshoot Specification...............................................................................28
2.12.1 Die Voltage Validation............................................................................29
2.13 GTL+ FSB Specifications ....................................................................................30
3 Package Mechanical Specifications.................................................................31
3.1 Package Mechanical Drawing.............................................................................31
3.2 Processor Component Keep-Out Zones .............................................................34
3.3 Package Loading Specifications .........................................................................34
3.4 Package Handling Guidelines .............................................................................35
3.5 Package Insertion Specifications ........................................................................35
3.6 Processor Mass Specification .............................................................................35
3.7 Processor Materials.............................................................................................35
3.8 Processor Markings.............................................................................................36
3.9 Processor Pinout Coordinates.............................................................................37
4 Pin Listing and Signal Descriptions.................................................................39
4.1 Processor Pin Assignments ................................................................................39
4.2 Alphabetical Signals Reference ..........................................................................54
5 Thermal Specifications and Design Considerations.................................63
5.1 Processor Thermal Specifications.......................................................................63
5.1.1 Thermal Specifications ...........................................................................63
5.1.2 Thermal Metrology .................................................................................64
5.2 Processor Thermal Features...............................................................................65
5.2.1 Thermal Monitor .....................................................................................65
5.2.2 On-Demand Mode..................................................................................65