Intel Celeron D Processor 3xx Sequence

4 Datasheet
5.2.3 PROCHOT# Signal Pin ..........................................................................66
5.2.4 THERMTRIP# Signal Pin .......................................................................66
5.2.5 T
CONTROL
and Fan Speed Reduction (Optional) ...................................67
5.2.6 Thermal Diode........................................................................................67
6Features.......................................................................................................................69
6.1 Power-On Configuration Options ........................................................................69
6.2 Clock Control and Low Power States..................................................................69
6.2.1 Normal State—State 1 ...........................................................................69
6.2.2 AutoHALT Powerdown State—State 2 ..................................................70
6.2.3 Stop-Grant State—State 3 .....................................................................71
6.2.4 HALT/Grant Snoop State—State 4 ........................................................71
6.2.5 Sleep State—State 5..............................................................................72
7 Boxed Processor Specifications.......................................................................73
7.1 Mechanical Specifications...................................................................................74
7.1.1 Boxed Processor Cooling Solution Dimensions.....................................74
7.1.2 Boxed Processor Fan Heatsink Weight..................................................75
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly .............................................................................75
7.2 Electrical Requirements ......................................................................................76
7.2.1 Fan Heatsink Power Supply...................................................................76
7.3 Thermal Specifications........................................................................................77
7.3.1 Boxed Processor Cooling Requirements ...............................................77
7.3.2 Variable Speed Fan ...............................................................................79
8 Debug Tools Specifications.................................................................................81
8.1 Logic Analyzer Interface (LAI).............................................................................81
8.1.1 Mechanical Considerations ....................................................................81
8.1.2 Electrical Considerations........................................................................81