Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet 3
Contents
1 Introduction..................................................................................................................9
1.1 Terminology...........................................................................................................9
1.1.1 Processor Packaging Terminology.........................................................10
1.2 References ..........................................................................................................11
2 Electrical Specifications........................................................................................13
2.1 System Bus and GTLREF ...................................................................................13
2.2 Power and Ground Pins ......................................................................................13
2.3 Decoupling Guidelines ........................................................................................13
2.3.1 VCC Decoupling.....................................................................................14
2.3.2 System Bus AGTL+ Decoupling.............................................................14
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................14
2.4 Voltage Identification...........................................................................................15
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................16
2.5 Reserved, Unused Pins, and TESTHI[12:0]........................................................18
2.6 System Bus Signal Groups .................................................................................19
2.7 Asynchronous GTL+ Signals...............................................................................20
2.8 Test Access Port (TAP) Connection....................................................................20
2.9 System Bus Frequency Select Signals (BSEL[1:0])............................................20
2.10 Maximum Ratings................................................................................................21
2.11 Processor DC Specifications...............................................................................21
2.11.1 Flexible Motherboard Guidelines (FMB).................................................21
2.12 AGTL+ System Bus Specifications .....................................................................28
2.13 System Bus AC Specifications ............................................................................29
2.14 Processor AC Timing Waveforms .......................................................................32
3 System Bus Signal Quality Specifications....................................................41
3.1 System Bus Clock (BCLK) Signal Quality Specifications ....................................41
3.2 System Bus Signal Quality Specifications and Measurement Guidelines...........42
3.3 System Bus Signal Quality Specifications and Measurement Guidelines...........45
3.3.1 Overshoot/Undershoot Guidelines .........................................................45
3.3.2 Overshoot/Undershoot Magnitude .........................................................45
3.3.3 Overshoot/Undershoot Pulse Duration...................................................45
3.3.4 Activity Factor.........................................................................................46
3.3.5 Reading Overshoot/Undershoot Specification Tables............................46
3.3.6 Conformance Determination to Overshoot/Undershoot
Specifications .........................................................................................47
4 Package Mechanical Specifications.................................................................51
4.1 Package Load Specifications ..............................................................................54
4.2 Processor Insertion Specifications ......................................................................55
4.3 Processor Mass Specifications ...........................................................................55
4.4 Processor Materials.............................................................................................55
4.5 Processor Markings.............................................................................................55