Datasheet

Intel

Itanium

Processor 9300 Series and 9500 Series Datasheet 119

Mechanical Specifications

4 Mechanical Specifications

The Intel

Itanium

Processor 9300 Series and 9500 Series are packaged in a FC-LGA

package that interfaces with the motherboard via an LGA1248 socket. The package top

side consists of lands that interface with a LGA connector for direct power delivery to

the core, cache and system interface. The package also consists of an integrated

heatsink spreader (IHS), which is attached to the package substrate and die and serves

as the mating surface for the processor component thermal solutions, such as a

heatsink. The bottom side of the package has 1248 lands, a 38 x 38 mm pad array

which interfaces with the LGA1248 socket. Figure 4-1 shows a sketch of the processor

package components and how they are assembled together.

The package components shown in Figure 4-1 include the following:

1. Integrated Heat Spreader (IHS).

2. Processor die.

3. Internal test pads for power delivery.

4. LGA lands for I/O.

5. Decoupling and server management components.

6. LGA lands for power delivery.

Note: This drawing is not to scale and is for reference only. Processor power delivery and thermal solutions,

and the socket are not shown.

Figure 4-1. Processor Package Assembly Sketch