Datasheet

Intel
®
Itanium
®
Processor 9300 Series and 9500 Series Datasheet 129
Mechanical Specifications
4.3 Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to both
the top-side and bottom-side of the package substrate. See Figure 4-4 for Intel
®
Itanium
®
9300 Series Processor keepout zones and Figure 4-8 for Intel
®
Itanium
®
9500 Series Processor keepout zones.
4.4 Package Loading Specifications
Table 4-1 provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
shipping conditions, or standard use condition. Also, any mechanical system or
component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solutions.
4.5 Package Handling Guidelines
Table 4-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Note:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization.
The Intel
®
Itanium
®
Processor 9300 Series can be inserted into and removed from a
LGA1248 socket and engaged and disengaged with the Ararat voltage regulator up to a
maximum limit as specified in Table 4-3.
Table 4-1. Processor Loading Specifications
Parameter Maximum Unit Notes
Static Compressive Load 1000 N
1, 2, 3
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2. This is the allowable static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3. These parameters are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
Dynamic Compressive Load
t < 30 ms
1793 N
1
,
3
Transient
t < 1 s
1090 N
1
,
3
Table 4-2. Package Handling Guidelines
Parameter Maximum Recommended Unit Notes
Shear 356 N 1, 4
Tensile 156 N 2, 4
Torque 8 N-m 3, 4