Datasheet

Thermal Specifications
140 Intel
®
Itanium
®
Processor 9300 Series and 9500 Series Datasheet
Note: Refer to the Package Mechanical Drawings in Chapter 4.
5.3 Storage Conditions Specifications
Environmental Storage Condition limits define the temperature and relative humidity
limits to which the device is exposed to while being stored. The specified storage
conditions are for component level prior to installation onto board.
Non operating storage condition limits for the component once installed onto the
application board are not specified. Intel does not conduct component level certification
assessments post subsequent applications such as components sub-assembly (FRU:
Field Replaceable Unit), or installation onto a board given the multitude of attach
methods, and board types used by customers. Provided as general guidance only,
Intel
®
board products are specified and certified to meet the following temperature and
humidity limits (Non-Operating Temperature Limit: -40°C to 70°C and Humidity: 50%
to 90%, non condensing with a maximum wet bulb of 28°C).
Table specifies absolute maximum and minimum storage temperature limits which
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. At conditions outside
sustained limits, but within absolute maximum and minimum ratings, quality and
reliability may be affected.
Figure 5-2. Intel
®
Itanium
®
Processor 9300 Series and Intel
®
Itanium
®
Processor 9500
Series Package Thermocouple Location
Not to scale.
Substrate
C
L
IHS
C
L
Thermocouple
Attach Point
1.5 mm
Substrate
C
L