Datasheet

168 Intel
®
Itanium
®
Processor 9300 Series and 9500 Series Datasheet
3.1.1 Package Bottom Pin Listing by Pin Name....................................................73
3.1.2 Pin Listing by Pin Number ........................................................................89
3.2 Processor Package Top Pin Assignments..............................................................105
3.2.1 Top-Side J1 Connector Two-Dimensional Table .........................................105
3.2.2 Top-Side J2 Connector Two-Dimensional Table .........................................108
3.2.3 Top-Side J3 Connector Two-Dimensional Table .........................................111
3.2.4 Top-Side J4 Connector Two-Dimensional Table .........................................114
4 Mechanical Specifications ......................................................................................119
4.1 Package Mechanical Drawing.............................................................................120
4.2 Intel
®
Itanium
®
Processor 9300 Series...............................................................121
4.3 Processor Component Keepout Zones.................................................................129
4.4 Package Loading Specifications..........................................................................129
4.5 Package Handling Guidelines.............................................................................129
4.6 Processor Mass Specifications............................................................................130
4.7 Processor Materials..........................................................................................130
4.8 Package Markings............................................................................................130
5 Thermal Specifications...........................................................................................133
5.1 Thermal Features.............................................................................................133
5.1.1 Digital Thermometer .............................................................................134
5.1.2 Thermal Management............................................................................135
5.1.3 Thermal Alert.......................................................................................136
5.1.4 TCONTROL...........................................................................................137
5.1.5 Thermal Warning..................................................................................137
5.1.6 Thermal Trip ........................................................................................137
5.1.7 PROCHOT ............................................................................................138
5.1.8 FORCEPR_N Signal Pin...........................................................................138
5.1.9 Ararat Voltage Regulator Thermal Signals ................................................138
5.2 Package Thermal Specifications and Considerations..............................................139
5.3 Storage Conditions Specifications.......................................................................140
6 System Management Bus Interface........................................................................143
6.1 Introduction....................................................................................................143
6.2 SMBus Memory Component...............................................................................144
6.2.1 Processor Information ROM (PIROM) .......................................................144
6.2.2 Scratch EEPROM...................................................................................149
6.2.3 PIROM and Scratch EEPROM Supported SMBus Transactions.......................150
6.3 Memory Component Addressing.........................................................................150
6.4 PIROM Field Definitions.....................................................................................152
6.4.1 General...............................................................................................152
6.4.2 Processor Data.....................................................................................152
6.4.3 Processor Core Data..............................................................................152
6.4.4 Processor Uncore Data ..........................................................................153
6.4.5 Cache Data..........................................................................................154
6.4.6 Package Data.......................................................................................155
6.4.7 Part Number Data.................................................................................155
6.4.8 Thermal Reference Data ........................................................................155
6.4.9 Feature Data........................................................................................156
6.4.10 Other Data ..........................................................................................157
6.4.11 Checksums..........................................................................................157
7Signal Definitions...................................................................................................159