DQ43AP

Material Declaration Datasheet
Restriction on Hazardous Substances (RoHS) Compliance
Manufacturer: Intel Corporation Date: 23 April 2009
Equipment type: Desktop CPU Board Lead-free product: Lead-free Second Level Interconnect (SLI)
Product Codes: BOXDQ43AP, BLKDQ43AP, BLKDB43LD
RoHS Definitions :
Quantity limit of 0.1% by mass (1000 ppm) for Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE). Quantity limit of 0.010% by mass (100 ppm) for Cadmium.
Intel understands RoHS compliance requires Lead and other materials banned in RoHS Directive are either (1) below all applicable
substance thresholds as proposed by the EU, or (2) an approved or pending exemption applies. Note, RoHS implementation details are
subjected to change.
RoHS Declaration:
This product is RoHS directive compliant but does contain Lead, a RoHS restricted substance per the definitions above. This product uses
the following applicable RoHS technology exemptions:
- Lead in glass of electronic components
- Lead in electronic ceramic parts (e.g. piezoelectronic devices)
- Lead as an alloying element in aluminum containing up to 0.4% lead by weight
- Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead)
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated
circuit Flip Chip packages
This product has been verified to be in conformance with EU directive 2002/95/EC as currently understood. To the best of our knowledge
the information contained in this declaration is true and correct.
Level A Materials and Substances
:
Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed below are not contained in this
product in quantities above the threshold level for these materials, nor intentionally added to this product.
Asbestos
Azo colorants
Cadmium/Cadmium compounds
Hexavalent Chromium
Hexavalent Chromium compounds
Mercury/Mercury compounds
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Diphenylethers (PBDEs)
Polychlorinated Biphenyls (PCBs)
Polychlorinated Naphthalenes
Radioactive substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
This product does contain Lead or Lead compounds in discrete component parts above the homogenous material threshold level of 1000
ppm per the RoHS exemptions above.
Level B Materials and Substances
:
This product does contain materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the
threshold level of 1000 ppm as listed below.
Material / Substance
Antimony/Antimony compounds
Brominated flame retardants
Nickel/Nickel compounds
Description of Use
flame retardant
flame retardant
plating
Location in Product
board substrate
board substrate
component plating
COMMENTS
1. The data reported for Level A and B materials and substances are based on analytical testing of a representative sample product.
Individual test results may vary due to differences in production and/or sensitivities of analytical testing methods. Data shown reflect
analytical testing intended to validate Intel's RoHS compliance systems. Intel’s certification of RoHS compliance at the homogenous
material level is based on Supplier Declarations of Conformance.
2. This declaration is based on the product specified, with all product skus of this product eligible to be covered by this declaration.
3. Material concentration data in parts per million (ppm) is representative of all product skus within the product family.
4. Material mass can be estimated by multiplying concentration (in ppm) by product weight.
5. The remainder of this product consists of non-reportable metals (i.e., copper, iron, tin), epoxy resin and other non-metal materials.
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO
THIS MDDS. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR
OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN
THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.