Intel® Desktop Board DH61ZE Technical Product Specification October 2012 Part Number: G48081-005 The Intel® Desktop Board DH61ZE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH61ZE Specification Update.
Revision History Revision Revision History Date ® -001 First release of the Intel Specification Desktop Board DH61ZE Technical Product October 2011 -002 Second release of the Intel® Desktop Board DH61ZE Technical Product Specification November 2011 -003 Updated the Board Identification Information section April 2012 -004 Updated the Board Identification Information section June 2012 -005 Specification Clarification October 2012 This product specification applies to only the standard Intel
Board Identification Information Basic Desktop Board DH61ZE Identification Information AA Revision BIOS Revision Notes G43004-101 BEH6110H.86A.0034 1,2 G43004-200 BEH6110H.86A.0034 1,2 G43004-201 BEH6110H.86A.0038 1,2 G43004-202 BEH6110H.86A.0038 1,2 G43007-101 BEH6110H.86A.0034 1,2 G43007-200 BEH6110H.86A.0034 1,2 G43007-201 BEH6110H.86A.0038 1,2 G43007-202 BEH6110H.86A.0038 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2.
Intel Desktop Board DH61ZE Technical Product Specification iv
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DH61ZE. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH61ZE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel Desktop Board DH61ZE Technical Product Specification Other Common Notation vi # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowe
Contents Revision History Board Identification Information .................................................................. iii Specification Changes or Clarifications .......................................................... iii Errata ......................................................................................................iii Preface Intended Audience..................................................................................... v What This Document Contains.........................
1.16 Power Management .......................................................................... 31 1.16.1 ACPI .................................................................................... 31 1.16.2 Hardware Support ................................................................. 34 2 Technical Reference 2.1 Memory Resources ........................................................................... 38 2.1.1 Addressable Memory ............................................................. 38 2.1.
Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance ...................................................................... 75 5.1.1 Safety Standards................................................................... 75 5.1.2 European Union Declaration of Conformity Statement ................ 76 5.1.3 Product Ecology Statements ................................................... 77 5.1.4 EMC Regulations .................................................................
16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. x Front Panel Audio Header for Intel HD Audio ........................................ 45 Front Panel Audio Header for AC ’97 Audio ........................................... 45 Front Panel USB Header .................................................................... 45 SATA Connectors ..............................................................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 7.80 inches [243.84 millimeters by 198.
Table 1. Feature Summary (continued) Peripheral Interfaces • Ten USB ports: ― Four USB 2.0 ports are implemented with stacked back panel connectors ― Six USB 2.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DH61ZE. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Table 2.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2.
1.2 Legacy Considerations This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following: • 1.3 1.4 No Parallel ATA (PATA) IDE drive connector Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DH61ZE http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.
Product Description Intel® H61 Express Chipset 1.5 The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, and PCI Express. The PCH is a centralized controller for the board’s I/O paths. For information about Refer to The Intel H61 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.
Table 3 lists the supported DIMM configurations. Table 3.
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3.
1.7 Graphics Subsystem The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card. 1.7.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for processors with Intel Graphics Technology. NOTE The board will support up to two integrated graphics interfaces plus one PCI Express Graphics card simultaneously with required changes to the BIOS setup. 1.7.1.
Product Description 1.7.2 PCI Express x16 Graphics The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1155 socket support discrete add in graphics cards through the PCI Express 2.0 x16 graphics connector: • • Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is 8 GB/s in each direction, simultaneously, when operating in x16 mode. Supports PCI Express GEN1 frequency of 1.
1.9 SATA Interfaces The board provides four 3 Gb/s SATA connectors, which support one device per connector. The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Product Description 1.11 Audio Subsystem The board supports Intel High Definition Audio through the Realtek ALC892 audio codec and the HDMI interface. The Realtek ALC892-based audio subsystem supports the following features: • • • • • • 6+2-channel audio with independent multi-streaming stereo. Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port.
1.11.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 16 1.11.2 Audio Headers and Connectors The board contains audio connectors and headers on both the back panel and the component side of the board.
Product Description 1.11.2.1 Analog Audio Connectors The available configurable back panel audio connectors are shown in Figure 4. Item Description A Line in B Line out/front speakers C Mic in/side surround Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers. For information about Refer to The back panel audio connectors Section 2.2.
1.
Product Description 1.12.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description A Link/Activity LED (green) B Link Speed LED (green/yellow) Figure 5. LAN Connector LED Locations Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 6. LAN Connector LED States LED Link/Activity Link Speed LED Color Green Green/Yellow LED State Condition Off LAN link is not established.
1.13 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the power supply 5V STBY rail.
Product Description 1.14 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Rear chassis fan header B Thermal diode, located on processor die C Processor fan header D Front chassis fan header E Thermal diode, located on the Intel H61 PCH Figure 6.
1.15 Platform Management and Security Intel DH61ZE Desktop Board integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller. 1.15.1 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification.
Product Description 1.16 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB Power Management Event signal (PME#) wake-up support PCI Express WAKE# signal support Wake from serial port Wake from PS/2 1.16.
1.16.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Product Description 1.16.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Power switch S3, S4, S5 RTC alarm S3, S4, S5 LAN S3, S4, S5 USB S3 PME# signal S3, S4, S5 WAKE# signal S3, S4, S5 Serial port S3 PS/2 S3, S4, S5 Notes: • S4 implies operating system support only.
1.16.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Product Description 1.16.2.
1.16.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Product Description 1.16.2.10 +5 V Standby Power LED The green +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the Standby Power indicator LED on the board. CAUTION If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 7.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Technical Reference Figure 8.
2.1.2 Memory Map Table 10 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K – 16777216 K 100000 – 400000000 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used.
Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors for the board. Item Description A B C D E F G H I J PS/2 keyboard/mouse connector USB 2.0 ports VGA connector Parallel port HDMI connector LAN USB 2.0 ports Line in Line out/front speakers Mic in/side surround Figure 9. Back Panel Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only.
2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers Table 11 lists the component-side connectors and headers identified in Figure 10.
Technical Reference Table 11.
2.2.2.1 Signal Tables for the Connectors and Headers Table 12. TPM Header Pin Signal Name Pin Signal Name 1 CK_33M_TPM_DIP 2 Ground 3 LFRAME# 4 Key (no pin) 5 PLTRST# 6 No connection 7 LAD3 8 LAD2 9 +3.3 V 10 LAD1 11 LAD0 12 Ground 13 No connection 14 No connection 15 +3.3 VSB 16 TPM_SERRQ 17 Ground 18 TPM_CLKRUN# 19 LPCPD# 20 No connection Table 13.
Technical Reference Table 16. Front Panel Audio Header for Intel HD Audio Pin Signal Name Pin Signal Name 1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN Table 17.
Table 20. Chassis Intrusion Header Pin Signal Name 1 Intruder# 2 Ground Table 21. Fan Headers Pin 4-Wire Support Pin 3-Wire Support 1 Ground 3 Ground 2 +12 V 2 FAN_POWER 3 FAN_TACH 1 FAN_TACH 4 FAN_CONTROL N/A N/A 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • PCI Express 2.0 x16: one PCI Express 2.0 x16 connector. This connector supports simultaneous transfer speeds of up to 8 GB/s of peak bandwidth per direction. PCI Express 2.
Technical Reference 2.2.2.3 Power Supply Connectors The board has the following power supply connectors: • • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected. Processor core power – a 2 x 2 connector.
2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 24 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 24.
Technical Reference 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 25 shows the default states for this LED. More options are available through BIOS setup. Table 25.
2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers 2.2.2.7 Low Pin Count (LPC) Debug Header During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h.
Technical Reference 2.3 BIOS Configuration Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 28 describes the jumper settings for the three modes: normal, configure, and recovery. Figure 13.
Table 28. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values.
Technical Reference Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header 2.4 The Intel® MEBX reset header (see Figure 14) allows you to reset the Intel AMT configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following: • • • Return all Intel ME parameters to their default values. Delete any user entered information, including PID/PPS and user entered Hash Certificates.
2.5 2.5.1 Mechanical Considerations Form Factor The board is designed to fit into a microATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 7.80 inches [243.84 millimeters by 198.12 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 15.
Technical Reference 2.6 Electrical Considerations 2.6.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
2.6.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 31 lists the current capability of the fan headers. Table 31. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A 2.6.
Technical Reference 2.7 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is required. Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.
Figure 16 shows the locations of the localized high temperature zones. Item Description A B C Processor voltage regulator area Processor Intel H61 Express Chipset Figure 16. Localized High Temperature Zones Table 32 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 32.
Technical Reference 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 280,583 hours. 2.
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in a 32 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as BEH6110H.86A.
Overview of BIOS Features Table 34 lists the BIOS Setup program menu features. Table 34.
3.2 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Overview of BIOS Features 3.4 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel® Flash Memory Update Utility, which requires booting from DOS.
3.4.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. For information about Refer to Intel® Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software tools http://developer.intel.com/products/motherboard/DH61ZE/ tools.htm and http://developer.intel.
Overview of BIOS Features 3.6 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth. 3.6.1 Optical Drive Boot Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification.
4 Error Messages and Beep Codes 4.1 Speaker The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST. 4.2 For information about Refer to The location of the onboard speaker Figure 1, page 13 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s piezoelectric speaker to beep an error message describing the problem (see Table 38). Table 38.
Error Messages and Beep Codes 4.3 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 39). Table 39. Front-panel Power LED Blink Codes Type Pattern F2 Setup/F10 Boot Menu Prompt None Note BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. 4.
4.5 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a POST card that can interface with the Low Pin Count (LPC) Debug header. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
Error Messages and Beep Codes Table 42.
Table 42.
Error Messages and Beep Codes Table 42.
Table 42. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration 0xB8 Resetting removable media 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection etc.
Error Messages and Beep Codes Table 43.
5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board DH61ZE: • • • • • 5.1.
5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DH61ZE is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).
Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.
Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E.
Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH61ZE meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: • • • • Energy Star v5.
Regulatory Compliance and Battery Disposal Information 5.1.6 Regulatory Compliance Marks (Board Level) Intel Desktop Board DH61ZE has the regulatory compliance marks shown in Table 46. Table 46. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. CE mark.
5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Regulatory Compliance and Battery Disposal Information 87
