DQ35MP Technical Product Specification
Table Of Contents
- Intel® Desktop Board DQ35MP Technical Product Specification
- Revision History / Disclaimer
- Preface
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Legacy Considerations
- 1.3 Online Support
- 1.4 Processor
- 1.5 System Memory
- 1.6 Intel® Q35 Express Chipset
- 1.7 Parallel IDE Controller
- 1.8 Real-Time Clock Subsystem
- 1.9 Legacy I/O Controller
- 1.10 Audio Subsystem
- 1.11 LAN Subsystem
- 1.12 Intel® Active Management Technology(Intel® AMT)
- 1.13 Hardware Management Subsystem
- 1.14 Power Management
- 1.15 Trusted Platform Module (TPM)
- 2 Technical Reference
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
- 5 Regulatory Compliance and Battery Disposal Information
Technical Reference
55
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel
82Q35 GMCH
D Intel
82801IDO ICH9DO
Figure 16. Localized High Temperature Zones
Table 28 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 28. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82Q35 GMCH 97
o
C (under bias)
Intel 82801IDO ICH9DO 92
o
C (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 15