Datasheet

Thermal Specifications and Design Considerations
76 Datasheet
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. To ensure maximum flexibility for future
requirements, systems should be designed to the 775_VR_CONFIG_06 guidelines, even
if a processor with a lower thermal dissipation is currently planned. In all cases the
Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to
remain within specification.
Table 26. Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended
HALT
Power (W)
1
NOTES:
1. Specification is at 35 °C T
C
and typical voltage loadline.
775_VR_
CONFIG_06
Guidance
2
2. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.
Minimum
T
C
(°C)
Maximum
T
C
(°C)
Notes
420 1.6 35.0 8
775_VR_CONFIG
_06
5
See Table 27,
Figure 16
3, 4
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T
C
will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for
the allowed combinations of power and T
C
.
430 1.8 35.0 8 5 3, 4
440 2.0 35.0 8 5 3, 4
450 2.2 35.0 8 5 3, 4