Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical Design Guidelines (TMDG) - For the Intel® 82945G/82945GZ/82945GC Graphics Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH) February 2008 Document Number: 307504-004
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Contents 1 Introduction .....................................................................................................7 1.1 1.2 2 Product Specifications......................................................................................11 2.1 2.2 2.3 2.4 3 Package 2.1.1 Package Thermal Thermal 2.4.1 2.4.2 2.4.3 Description..............................................................................11 Non-Grid Array Package Ball Placement ......................................
Figures Figure 1. (G)MCH Non-Grid Array ......................................................................12 Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16 Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)...........................................................................16 Figure 4. Airflow Temperature Measurement Locations .........................................17 Figure 5.
Revision History Revision Number -001 Description • Initial Release Date May 2005 ® -002 • Added Intel 82945PL specifications October 2005 -003 • Added Intel® 82945GZ specifications December 2005 -004 • Added Intel® 82945GC specifications February 2008 § Thermal and Mechanical Design Guidelines 5
Thermal and Mechanical Design Guidelines
Introduction 1 Introduction As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits.
Introduction 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style.
Introduction 1.2 Reference Documents Document Comments Intel 945G/945GZ/945P/945PL Express Chipset Family Datasheet http://developer.intel.com/des ign/chipsets/datashts/307502. htm Intel® I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de sign/chipsets/datashts/30701 3.htm Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//de sign/chipsets/designex/30701 5.
Introduction 10 Thermal and Mechanical Design Guidelines
Product Specifications 2 Product Specifications This chapter provides the package description and loading specifications. The chapter also provides component thermal specifications and thermal design power descriptions for the (G)MCH. 2.1 Package Description The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm [0.378in] x 10.6 mm [0.417in].
Product Specifications Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit.
Product Specifications 2.3 Thermal Specifications To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for case temperature measurements. The (G)MCH must also operate above the minimum case temperature specification listed in Table 2.
Product Specifications 2.4.1 Methodology 2.4.1.1 Pre-Silicon To determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on extensive knowledge of the past chipset power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP. Knowledge of applications available today and their ability to stress various components of the chipset is also included in the model.
Thermal Metrology 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. 3.1 Case Temperature Measurements To ensure functionality and reliability, the (G)MCH is specified for proper operation when TC is maintained at or below the maximum temperature listed in Table 2.
Thermal Metrology Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.
Thermal Metrology Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be measured using industry standard air velocity sensors. Typical airflow sensor technology may include hot wire anemometers. Figure 4 provides guidance for airflow velocity measurement locations. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations for a specific chassis.
Thermal Metrology 18 Thermal and Mechanical Design Guidelines
Reference Thermal Solution 4 Reference Thermal Solution The reference component thermal solution for the (G)MCH for ATX platforms uses two ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH heatsink. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH. 4.
Reference Thermal Solution Figure 5.
Reference Thermal Solution Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform Airflow Direction (G)MCH Balanced Technology Extended (BTX) Thermal Module Assembly Over Processor Top View Proc_HS_Orient 4.2 Mechanical Design Envelope The motherboard component keep-out restrictions for the (G)MCH on an ATX platform are included in Appendix B, Figure 10.
Reference Thermal Solution Figure 7.
Reference Thermal Solution Figure 8.
Reference Thermal Solution 4.4 Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 4. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements. Table 4.
Enabled Suppliers Appendix A Enabled Suppliers Current suppliers for the Intel® 945G/945GZ/945GC/945P/945PL Express chipset (G)MCH reference thermal solution are listed in Table 5 and Table 6. Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers Supplier CCI (Chaun Choung Technology Corp) Intel Part Number Vendor Part Number Contact Information C85366-001 (heatsink) 00C863501A Monica Chih - +886 (-2) 29952666 C85370-001 (ramp retainer) 334C863501A 334C863502A monica_chih@ccic.com.
Enabled Suppliers Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers Supplier CCI (Chaun Choung Technology Corp.) AVC (Asia Vital Components) Foxconn/HonHai Precision Intel Part Number Vendor Part Number C57359-001 00C863401A Contact Information Monica Chih - +886 (-2) 29952666 monica_chih@ccic.com.tw Harry Lin - (714) 739-5797 hlinack@aol.com C57359-001 S909700001 David Chao - +886 (-2) -22996930 x619 david_chao@avc.com.
Mechanical Drawings Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document.
Figure 9.
135 Thermal and Mechanical Design Guidelines 45.79 [ 1.803 ] 67 [ 2.638 ] 81 [ 3.189 ] 47 [ 1.85 ] 26.79 [ 1.055 ] 48 [ 1.890 ] 60.6 [ 2.386 ] NORTH 4 [ .1575 ] 60.92 [ 2.398 ] 74 [ 2.9134 ] DET AIL A MAX 25 [1.000] COMPONENT HEIGHT MAX 1.27 [.050] COMPONENT HEIGHT (NON-MCH COMPONENT S) COMPONENT CENT ER EAST 4X 1.84 [ .072 ] 4X 5.08 [ .200 ] NO COMPONENT S T HIS AREA Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms Mechanical Drawings A 0.97 [ .
61.98 [ 2.440 ] 55.88 [ 2.200 ] 46.48 [ 1.830 SCALE ] 48.26 [ 1.900 ] 4 DETAIL B B 2X 5.72 [ .225 ] 2X 2.54 [ .100 ] MAX 1.27[.050] COMPONENT HEIGHT COMPONENT CENTER DETAIL A 4X 2.1 [ .0 83 ] 0.97 [ .038 ] PLATED THRU HOLE 1.42[.056] TRACE KEEPOUT NO COMPONENTS THIS AREA 8X 8X DETAIL SCALE 2X 2.29 [ .090 ] DETAIL SCALE 5 B 8 A 4X 8.76 4X 5.08 [ .345 ] [ .200 ] 4X 1.85 [ .073 ] Thermal and Mechanical Design Guidelines NOTES: 1 .
7X E Q U A L S P A CING 36 [ 1. 417 ] 2X 48 0. 15 [ 1. 890 . 005 ] Thermal and Mechanical Design Guidelines 2X 80 [ 3. 150 ] 47 [ 1. 850 ] 2X 58. 6 [ 2. 307 ] 6 2X 0. 15 . 005 ] 8X 2. 7 0. 15 [ . 106 . 005 ] 59. 28 [ 2. 334 S E E DE T A IL 6 A 16X 1. 2 0. 15 [ . 047 . 005 ] 4 [ . 157 ] 14X E Q U A L S P A CING F U LL R O U N D T Y P 35. 5 [ 1. 398 ] Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 Mechanical Drawings 30. 5 [ 1. 201 ] SE E DET A IL T Y P 3. 7 5 0.
2X 15 [ . 591 ] C H OM E R IC S : 69-12-22350-T 710 66 [ 2. 5984 ] 5 BO T T O M VIEW 0. 1 [ . 003] 4X 45 25. 5 [ 1. 004 ] 16 [ . 630 ] X 1 [ . 039] 1. 5 0. 15 [ . 059 . 005 ] 6 TYP R 1 [ . 039 ] Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 T Y P DE T A IL S C A LE 5 TYP. A T Y P 135 6. 72 [ . 265 6 N O B U R R A LL A R O U N D 0. 15 . 005 ] R0. 5 [ . 020 ] 6 DE T A IL B S C A LE 5 T Y P 2. 75 [ . 108 0. 1 . 003 ] TYP 4 [ .
0. 12 . 004 ] 6 6 5. 08 0. 12 [ . 200 . 004 ] 6 Thermal and Mechanical Design Guidelines 4X 7. 83 [ . 308 5. 21 0. 12 [ . 205 . 004 ] 2X 0. 75 [ . 030 ] 2X 4 [ . 157 ] 7. 62 0. 15 [ . 300 . 005 ] 0. 64 [ ] 0. 12 . 004 ] 0 -0. 07 . 025 + . 000 -. 002 2X 10. 13 [ . 39 9 2. 5 0. 15 [ . 098 . 005 ] 0. 1 . 003 ] 2X 0. 5 0. 05 [ . 020 . 001 ] 2X 0. 77 [ . 030 6 Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor Mechanical Drawings [ ] 45 2 X 0. 2 M I N 2X 3. 94 0. 15 [ .
2X 31. 1 [ 1. 225 ] 2X 27. 95 [ 1. 100 ] 3 [ . 118 ] S EE DE T A IL 2 0. 05 [ . 079 . 001 ] A 6 S E E DE T A IL C 5 61. 51 6 [ 2. 422 ] 70. 49 [ 2. 775 ] 6 Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 Thermal and Mechanical Design Guidelines 1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D D A T A B A S E F I LE .
3 [ . 118 ] Thermal and Mechanical Design Guidelines 5. 2 [ . 205 ] 4. 7 5 6 [ . 187 ] B 6. 55 [ . 258 ] B 2. 75 [ . 108 ] 3. 15 [ . 124 ] 6 6 0. 5 [ . 020 ] 2X D E T A I L S C A LE 20 6 1. 75 [ . 069 ] A 1. 19 [ . 047 ] SE CT IO N Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 Mechanical Drawings B -B 6 6 4 [ . 157 ] 2X 5. 76 [ . 227 ] 5. 56 [ . 219 ] 6. 4 [ . 252 ] 2X 2. 9 [ .
27. 7 [ 1. 090 ] 4 A 27. 3 0. 5 [ 1. 075 . 019 ] A2 2X 90 19. 3 0. 5 [ . 76 0 . 019 ] A3 61. 74 [ 2. 431 F A R S ID E F A R S IDE 37. 06 [ 1. 459 ] A3 A2 0. 5 . 019 ] A A1 0. 5 46. 6 [ 1. 8 35 . 019 ] A 2. 65 [ . 104 ] A3 A2 S E CT IO N A -A T Y P R 1. 8 [ . 071 ] Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip A Thermal and Mechanical Design Guidelines 1.
19 [ .748 ] 47.88 [ 1.885 ] 15X EQU AL SPAC ES ( 1.94 ) [ .08 ] R 0 TO FU LL Thermal and Mechanical Design Guidelines 19 [ .748 ] 2X 1.2 [ .047 ] 2X 1.17 [ .046 ] FU LL R B ( 33 ) [ 1.30 ] ( 55.88 ) [ 2.20 ] 3 3.4 0.2 [ .134 .007 ] B C R 0 TO 0.5[.020] 0.08 [.003] 0.25 [.009] A 2X 7.25 0.2 [ .285 .007 ] 16X 1.17 [ .046 ] C ( 15 ) [ .591 ] 3 0.2 [ .118 .007 ] 3 24.2 [ .953 ] 3 0.25 [ .118 .009 ] N OTES: 1. PR OC U R EM EN T SPEC IFIC ATION A02160 SH ALL APPLY 2.
4 8.87 [ .349 1.25 .049 ] 62.6 1 [ 2.465 .039 ] 35.3 [ 1.390 ] 27.3 [ 1.075 ] B R 1.3 [ .051 ] TYP 47.36 [ 1.865 ] B A A1 ( 3.80 ) [ .150 ] 2X 90 ( 1.80 ) [ .071 ] A3 A2 A A FAR SIDE SEE DETAIL FAR SIDE FAR SIDE A1 C DETAIL SCALE A3 2X 26.16 [ 1.030 4X R 1.8 [ .071 ] C 8:1 ] SECTION B-B SCALE 10:1 A2 4 3.8 [ .150 ] VIEW A 25.14 [ .990 ] ( 10.27 ) [ .404 ] A 4.1 [ .161 ] 1.8 MM STOCK WIRE TERMINATION WITHIN 10.0 Thermal and Mechanical Design Guidelines NOTES: 1.
5 Thermal and Mechanical Design Guidelines 2 1 3 C ( 19 ) [ .748 ] ( 55.88 ) [ 2.200 ] 0.25 [.009] A B C ( 19 ) [ .748 ] ( 33 ) [ 1.299 ] B NOTES: 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS INDICATED OTHERWISE. 2. FINISH: NONE 3. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
