User's Manual

Mechanical Drawingss
30 Thermal and Mechanical Design Guidelines
Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
4X 8.76
.3 45[]
4X 4.19
.1 65[]
4X 1.85
.073[]
4X 5.08
.2 0 0[]
4X 2.1
.083[]
8X PLATED THRU HOLE0.97 .038[]
48.26
1.900[]
55.88
2. 2 00[]
2X 3.3
.1 30[]
2X 2.29
.0 90[]
2X 2.54
.1 00[]
2X 5.72
.2 25[]
61.98
2.440[]
46.48
1.830[]
B
8X 1.42[.056] TRACE KEEPOUT
D ETAIL A
N O C OMPO N EN TS TH IS AR EA
MAX 1 .27 [.0 5 0] C O MPO N EN T H EIG H T
D ETAIL B
MAX 1 .7 8 [.0 7 0 ] C O M PO N EN T H EIG H T
NOTES:
1 . H O LE PL AC EMEN T FABR IC AT IO N
TOLERANCE PER INTEL 454979, CLASS 1,2,3 2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED 26.9MM ABOVE MOTHERBOARD SURFACE.
COMPONENT CENTER
SCALE 4
DETAIL A SCALE 8
DETAIL B SCALE 5