User's Manual

Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction.....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9
2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Methodology...........................................................................14
2.4.2 Application Power....................................................................14
2.4.3 Specifications .........................................................................14
3 Thermal Metrology..........................................................................................15
3.1 Case Temperature Measurements...........................................................15
3.1.1 Thermocouple Attach Methodology.............................................15
3.2 Airflow Characterization ........................................................................16
4 Reference Thermal Solution..............................................................................19
4.1 Operating Environment .........................................................................19
4.1.1 ATX Form Factor Operating Environment ....................................19
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................
20
4.2 Mechanical Design Envelope...................................................................21
4.3 Thermal Solution Assembly....................................................................21
4.4 Environmental Reliability Requirements...................................................24
Appendix A Enabled Suppliers ...........................................................................................25
Appendix B Mechanical Drawings.......................................................................................27