R mPGA604 Socket Design Guidelines Revision 1.
R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your product order. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
R Contents 1 Introduction ....................................................................................................................... 9 1.1 Objective ................................................................................................................ 9 1.2 Purpose.................................................................................................................. 9 1.3 Scope ...............................................................................................
R 5 Environmental Requirements ........................................................................................ 29 5.1 Porosity Test ........................................................................................................ 30 5.1.1 Porosity Test Method .............................................................................. 30 5.1.2 Porosity Test Criteria .............................................................................. 30 5.2 Plating Thickness ...................
R Tables 2-1 3-1 4-1 4-2 4-3 4-4 5-1 Package Critical-To-Function (CTF) Dimensions ................................................ 11 Socket Critical-to-Function Dimensions ............................................................... 17 Electrical Requirements for Sockets .................................................................... 19 Definitions ............................................................................................................ 19 Resistance Test Fixtures Netlist ....
R Revision History Revision Number 1.0 6 Description • Initial release of the document.
R Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented.
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R 1 Introduction 1.1 Objective This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard.
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R 2 Assembled Component and Package Description Information provided in this section is to ensure dimensional compatibility of the mPGA604 socket with that of the 604-pin processor package. The processor package must be inserted into the mPGA604 socket with zero insertion force when the socket is not actuated. 2.1 Assembled Component Description The assembled component may consist of a heatsink, EMI shield, clips, fan, retention mechanism (RM), and processor package.
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R 3 Mechanical Requirements 3.1 Mechanical Supports A retention system needs to isolate any load in excess of 50 lbf, compressive, from the socket during the shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical shock and vibration requirements listed in Sections 5 with the associated heatsink and retention mechanism attached. socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive, etc.
R Mechanical Requirements Proper seating 3.5 Markings All markings required in this section must be able to withstand a temperature of 240°C for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5. 3.5.1 Name mPGA604 (font type is Helvetica Bold – minimum 6 point). This mark shall be molded or Laser Marked into the processor side of the socket housing.
R Mechanical Requirements 3.6 Socket Size The socket size must meet the dimensions as shown in Figure A-5 and Figure A-6, allowing full insertion of the pins in the socket, without interference between the socket and the pin field. The mPGA604 socket and actuation area must fit within the keep-in zone defined in Figure A-6. 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated package pin field displacement will not exceed 1.27 mm.
R Mechanical Requirements 3.9.6 Lubricants For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are used elsewhere within the socket assembly, these lubricants must not be able to migrate to the socket contacts. 3.10 Material and Recycling Requirements Cadmium shall not be used in the painting or plating of the socket. CFCs and HFCs shall not be used in manufacturing the socket.
R Mechanical Requirements 3.16 Critical-to-Function Dimensions The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric. Asymmetric features are designed to properly align the socket to the motherboard and prevent the socket from being assembled incorrectly to the motherboard. Critical-to-function (CTF) dimensions are identified in Table 3-1.
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R 4 Electrical Requirements Socket electrical requirements are measured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field. Table 4-1.
R Electrical Requirements 4.1 Electrical Resistance Figure 4-1 and Figure 4-2 show the proposed methodology for measuring the final electrical resistance. The methodology requires measuring interposer flush-mounted directly to the motherboard fixtures, so that the pin shoulder is flush with the motherboard, to get the averaged jumper resistance, Rjumper. The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture.
R Electrical Requirements Figure 4-3.
R Electrical Requirements Table 4-3.
R Electrical Requirements Table 4-3.
R Electrical Requirements 4.2 Determination of Maximum Electrical Resistance This section provides a guideline for the instruments used to take the measurements. Note: The instrument selection should consider the guidelines in EIA 364-23A. 1. These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current. The other is a precision voltmeter circuit to measure the voltage drop between the desired points. 2.
R Electrical Requirements Figure 4-4. Inductance Measurement Fixture Cross-Section Probing Pads Surface 40 mils Interposer No Features or Plane on this Layer Socket Interposer Pin No Plane on this Layer Motherboard Full Plane on this Layer Short all L pins (using a solid plane) No Features or Plane on this Layer Interposer Interposer Shoulder Short all L pins (using a solid plane) Motherboard Figure 4-5. Inductance and Capacitance Fixture A B 1 4 5 AC AD 8 2 3 6 7 1 2 29 30 4.3.
R Electrical Requirements 4. Calibration – Cascade Calibration Substrates or equivalent. 5. Measurement objects – packages, sockets, motherboards. Measurement Steps: • Equipment Setup Cables should be connected to the network analyzer and to the probes using the appropriate torque wrench to ensure consistent data collection every time the measurement is performed. • Set VNA Bandwidth = 30 0KHz – 3 GHz with 801 points. Averaging Factor = 16.
R Electrical Requirements for the socket. The shoulder of the interposer is not included in the electrical modeling. If there is any difference between them, it will be called the de-embedded correction factor. Adding the interposer to the socket and then eliminating the contribution of the fixture creates this correction factor because inductance is not linear. 4.
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R 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a desktop product. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-1.
R Environmental Requirements Table 5-1. Use Conditions Environment (Continued) Use Environment Speculative Stress Condition 7 Year Life Expectation Fast, large gradient on/off to max operating temp. (power cycle or internally heated including power save features). Power Cycle 7,500 cycles Shipping and Handling. Mechanical Shock 3 drops / axis 6 axis 50g trapezoidal profile; 170”/sec Velocity change; 11 msec duration pulse Shipping and Handling. Random Vibration 3.13 gRMS, random, 5 Hz - 20 Hz .
R Environmental Requirements 5.5 Durability Use per EIA 364, test procedure 09B. The same package pin field is to be used for 1st and 51st cycles. Measure contact resistance when mated in 1st and 51st cycles. A spare package pin field is used for 2nd through 50th cycles. A pair of new package pin fields to be used for each of the socket samples. The package should be removed at the end of each de-actuation cycle and reinserted into the socket.
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R 6 Validation Testing Requirements This section of the document outlines the tests that must be successfully completed in order for the supplier's socket to pass the design guidelines validation. It provides the test plan and procedure required for validation. 6.1 Applicable Documents EIA-364-C. Electrical Mechanical and Thermal Specification (EMTS)* Thermal Design Guidelines Document* Note: *For details on ordering this documentation, contact your Intel field sales representative. 6.
R Validation Testing Requirements 6.7 Quality Assurance Requirements The OEM’s will work with the socket supplier(s) they choose to ensure socket quality. 6.8 Socket Test Plan 6.8.1 Submission of an mPGA604 Socket for Validation Testing The socket supplier's mPGA604 socket will be sent to Intel's independent test facility for socket validation testing. The sockets submitted must be per the drawing required in Section 6.4. Refer to Sections 6.11 and 6.
R 7 Safety Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following safety standards: • UL 1950 most current editions. • CSA 950 most current edition. • EN60 950 most current edition and amendments. • IEC60 950 most current edition and amendments.
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R 8 Documentation Requirements The socket supplier shall provide Intel with the following documentation: • Multi-Line Coupled SPICE models for socket. • Product design guideline incorporating the requirements of these design guidelines. • Recommended board layout guidelines for the socket consistent with low cost, high volume printed circuit board technology.
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