Datasheet

Datasheet 3
Contents
1Introduction..............................................................................................................9
1.1 Terminology .......................................................................................................9
1.1.1 Processor Packaging Terminology .............................................................10
1.2 References ....................................................................................................... 11
2 Low Power Features ................................................................................................13
2.1 Power-On Configuration Options..........................................................................13
2.2 Clock Control and Low Power States ....................................................................13
2.2.1 Normal State.........................................................................................14
2.2.1.1 HALT Powerdown State..............................................................14
2.2.2 Stop Grant State....................................................................................15
2.2.3 HALT Snoop State and Stop Grant Snoop State ..........................................15
3 Electrical Specifications...........................................................................................17
3.1 Power and Ground Pins ...................................................................................... 17
3.2 Decoupling Guidelines........................................................................................ 17
3.2.1 VCC Decoupling .....................................................................................17
3.2.2 VCCP Decoupling....................................................................................17
3.2.3 FSB Decoupling......................................................................................18
3.3 Voltage Identification.........................................................................................18
3.4 Catastrophic Thermal Protection..........................................................................22
3.5 Reserved and Unused Pins.................................................................................. 22
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................22
3.7 Voltage and Current Specification........................................................................23
3.7.1 Absolute Maximum and Minimum Ratings .................................................. 23
3.7.2 DC Voltage and Current Specification........................................................ 24
3.7.3 VCC Overshoot ......................................................................................26
3.7.4 Die Voltage Validation.............................................................................27
3.8 Signaling Specifications...................................................................................... 27
3.8.1 FSB Signal Groups..................................................................................27
3.8.2 CMOS and Open Drain Signals .................................................................29
3.8.3 Processor DC Specifications .....................................................................30
3.8.3.1 GTL+ Front Side Bus Specifications .............................................31
3.9 Clock Specifications...........................................................................................32
3.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................32
4 Package Mechanical Specifications and Pin Information ..........................................33
4.1 Package Mechanical Specifications....................................................................... 33
4.1.1 Processor Component Keep-Out Zones......................................................33
4.1.2 Package Loading Specifications ................................................................33
4.1.3 Processor Mass Specifications ..................................................................34
4.1.4 Processor Markings.................................................................................37
4.2 Processor Pinout and Pin List ..............................................................................37
4.3 Alphabetical Signals Reference............................................................................52
5 Thermal Specifications ............................................................................................61
5.1 Thermal Specifications.......................................................................................61
5.2 Processor Thermal Features................................................................................62
5.2.1 Thermal Monitor.....................................................................................62
5.2.2 On-Demand Mode ..................................................................................62
5.2.3 PROCHOT# Signal..................................................................................63
5.2.4 THERMTRIP# Signal ...............................................................................63