Datasheet

Datasheet 33
Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin
Information
4.1 Package Mechanical Specifications
The Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package
shown in Figure 4.
4.1.1 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted in the keep-
out areas. The location and quantity of the capacitors may change but will remain
within the component keep-in. See Figure 5 for keep-out zones.
4.1.2 Package Loading Specifications
Maximum mechanical package loading specifications are given in Figure 4. These
specifications are static compressive loading in the direction normal to the processor.
This maximum load limit should not be exceeded during shipping conditions, standard
use condition, or by the thermal solution. In addition, there are additional load
limitations against transient bend, shock, and tensile loading. These limitations are
more platform specific and should be obtained by contacting your field support.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution.