Datasheet

Package Mechanical Specifications and Pin Information
34 Datasheet
4.1.3 Processor Mass Specifications
The typical mass is given in Figure 4 and Table 16. This mass includes all the
components that are included in the package.
Table 16. Micro-FCBGA Package Mechanical Specifications
Symbol Parameter Min Max Unit Figure
B1 Package substrate width 34.95 35.05 mm Figure 4
B2 Package substrate length 34.95 35.05 mm Figure 4
C1 Die width 11.1 mm Figure 4
C2 Die length 8.2 mm Figure 4
F2 Die height (with underfill) 0.89 mm Figure 4
F3
Package overall height (package
substrate to die)
2.022 Max mm Figure 4
G1
Width (first ball center to lass ball
center)
31.75 Basic mm Figure 4
G2
Length (first ball center to last ball
center)
31.75 Basic mm Figure 4
J1 Ball pitch (horizontal) 1.27 Basic mm Figure 4
J2 Ball pitch (vertical) 1.27 Basic mm Figure 4
M Solder Resist Opening 0.61 0.69 mm Figure 4
NBall height 0.6 0.8 mmFigure 4
—
Corener Keep-out zone at corner
(4X)
7 x 7 mm Figure 5
—
Keep-out from edge of package
(4x)
5mmFigure 5
— Package edge to first ball center 1.625 mm Figure 5
P
die
Allowable pressure on the die for
thermal solution
689 kPa
WPackage weight 6 g