Intel Pentium 4 Processor 423 Pin Socket (PGA423) Design Guidelines

®
423 Pin Socket Design Guidelines
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between the socket and the pin field. Actuation lever arm in locked
position must have the same profile as the socket cam and housing,
and must not interfere with the heatsink protrusion. The total
thickness of the cam house must reside within 0.350in from the
bottom surface of the socket.
3.3.3.4. Socket/Package pin field Movement
The socket will be built so that the package pin field displacement
will not exceed 0.060in during engagement and disengagement.
3.3.4. Contact Characteristics:
3.3.4.1. Number of contacts:
Total number of contacts: 423
3.3.4.2. Base Material:
High strength copper alloy.
3.3.4.3. Contact Area Plating:
15µin (min) gold plating over 50µin (min) nickel underplate in
critical contact areas (area on socket contacts where package pins will
mate), and plating must be able to pass the tests outlined in sections 4
and 5.
3.3.4.4. Solder tails plating:
100µin (min) tin lead over 50µin (min) nickel underplate.
3.3.4.5. Lubricants:
No lubricants shall be used on the socket contacts or in the cam.
3.3.5. Environmental Concerns Requirements:
Cadmium shall not be used in the painting or plating of the socket.
CFCs and HFCs shall not be used in manufacturing the socket.
3.4. Socket Manufacturability Requirements:
The socket must be a thru-hole socket design.
3.4.1. Overall Assembly Sequence:
Solder socket to motherboard