Intel Pentium 4 Processor 423 Pin Socket (PGA423) Design Guidelines

®
423 Pin Socket Design Guidelines
3
1. INTRODUCTION ................................................................................................................................................ 6
1.1. O
BJECTIVE
:.............................................................................................................................................................. 6
1.2. P
URPOSE
:................................................................................................................................................................. 6
1.3. S
COPE
:..................................................................................................................................................................... 6
2. PROCESSOR PACKAGE DESCRIPTION....................................................................................................... 6
2.1. P
ACKAGE
O
UTLINE
:................................................................................................................................................. 6
2.2. P
IN
D
IMENSIONS
:..................................................................................................................................................... 6
3. MECHANICAL REQUIREMENTS................................................................................................................... 9
3.1. P
IN
-O
UT AND
O
RIENTATION
D
IAGRAM
:.................................................................................................................. 9
3.2. M
ECHANICAL
S
UPPORTS
: ........................................................................................................................................ 9
3.3. M
ATERIALS
: .......................................................................................................................................................... 14
3.3.1. Socket Housing:............................................................................................................................................ 14
3.3.2. Color:............................................................................................................................................................ 14
3.3.3. Markings:...................................................................................................................................................... 14
3.3.3.1. Name:................................................................................................................................................ 14
3.3.3.2. Lot Traceability:................................................................................................................................14
3.3.3.3. Socket Size:....................................................................................................................................... 14
3.3.3.4. Socket/Package pin field Movement................................................................................................. 15
3.3.4. Contact Characteristics:............................................................................................................................... 15
3.3.4.1. Number of contacts:.......................................................................................................................... 15
3.3.4.2. Base Material:................................................................................................................................... 15
3.3.4.3. Contact Area Plating:........................................................................................................................ 15
3.3.4.4. Solder tails plating: ........................................................................................................................... 15
3.3.4.5. Lubricants: ........................................................................................................................................ 15
3.3.5. Environmental Concerns Requirements: ...................................................................................................... 15
3.4. S
OCKET
M
ANUFACTURABILITY
R
EQUIREMENTS
:.................................................................................................. 15
3.4.1. Overall Assembly Sequence:......................................................................................................................... 15
3.4.2. Socket Engagement/Disengagement Force: ................................................................................................. 16
3.4.3. Visual Aids:................................................................................................................................................... 16
3.4.4. Solderability Test:......................................................................................................................................... 16
3.5. A
SSEMBLY
R
EQUIREMENTS TO THE
M
OTHERBOARD
:............................................................................................ 16
3.5.1. Pre- Solder Attachment: ............................................................................................................................... 16
3.5.2. Solder Tail Design and Alignment:............................................................................................................... 16
3.6. S
OCKET
C
RITICAL
T
O
F
UNCTION
(CTF) D
IMENSIONS
:.......................................................................................... 16
4. ELECTRICAL REQUIREMENTS .................................................................................................................. 22
4.1. E
LECTRICAL
R
ESISTANCE
:..................................................................................................................................... 22
4.1.1. Determination of Maximum Electrical Resistance: ...................................................................................... 24
4.1.2. Initial/Final Electrical Resistance:............................................................................................................... 24
4.2. I
NDUCTANCE
: ........................................................................................................................................................ 25
4.2.1. Procedure for Inductance Measurements:.................................................................................................... 27
4.2.1.1. Mounted Directly to Motherboard Fixture:....................................................................................... 27
4.2.1.2. Mounted to Socket:........................................................................................................................... 27
4.2.1.3. Equations: ......................................................................................................................................... 27
4.2.2. Loop Inductance:.......................................................................................................................................... 28
4.3. P
IN
-
TO
-P
IN
C
APACITANCE
:.................................................................................................................................... 28
4.4. C
ONTACT
C
URRENT
R
ATING
:................................................................................................................................28
4.5. D
IELECTRIC
W
ITHSTAND
V
OLTAGE
: ..................................................................................................................... 29
4.6. I
NSULATION
R
ESISTANCE
:..................................................................................................................................... 29
5. ENVIRONMENTAL REQUIREMENTS ........................................................................................................ 29
5.1. T
EMPERATURE
R
ANGE
: ......................................................................................................................................... 29