Intel Pentium 4 Processor 423 Pin Socket (PGA423) Design Guidelines

423 Pin Socket Design Guidelines

5.5. Temperature Shock:

Test per EIA 364 TP 32B, Test Condition ( I ) for 5 cycles.

5.6. Cyclic Humidity:

Test per EIA 364 Test Procedure 31 and Test Condition B for 240 hours.

5.7. Temperature Life (Bake Test):

Test per EIA 364 Test Procedure 17 at 85 °C for 500 hours. Precondition samples with

three insertion/extractions (min).

5.8. Solder Withstand Temperature:

Test per EIA 364, Test Procedure 56A, Procedure 5.

5.9. Porosity Test:

5.9.1. Porosity Test Method:

EIA 364, Test Procedure 60, paragraph 7 or 8.

5.9.2. Porosity Test Criteria:

Maximum of two pores per set of 20 contacts, as measured per EIA 364, Test

Procedure 60.

5.10. Plating Thickness:

Record thickness of plating on contact surface per EIA 364, Test Procedure 48, Method A

or C. Test to be performed using 20 randomly selected contacts per socket. No plating

thickness measured shall be less than the minimum plating thickness specified in Sections

3.3.4.3 and 3.3.4.4.

5.11. Solvent Resistance:

Requirement: No damage to ink markings if applicable and socket body.

EIA 364, Test Procedure 11A.

5.12. Solderability:

Requirement: 95% coverage per tail.

EIA 364, Test Procedure 52, Class 2, Category 3. Test to be performed on 20 randomly

selected contacts per socket.