Intel Pentium 4 Processor 423 Pin Socket (PGA423) Design Guidelines

423 Pin Socket Design Guidelines

5.13. Post Reliability Testing Inspection of Package pin field:

In case of electrical failures post shock and vibration testing: remove the package from

the socket. Inspect for visual evidence of fretting corrosion on the pins. When a pass/fail

decision cannot be made based on the visual inspection of the package pin field, the part

may be sent out for SEM analysis.

Requirement: No visual evidence of fretting corrosion on any package pins.

6. QUALIFICATION TESTING REQUIREMENTS

This section of the document outlines the tests that must be successfully completed in order for

the supplier's socket to pass the design guidelines validation. It provides the test plan and

procedure required for validation.

6.1. Applicable Documents:

Intel

Pentium

4 Processor In the 423-Pin Package Datasheet

6.2. Testing Facility:

Testing will be performed by Intel's designated test facility.

6.3. Funding:

Socket supplier will fund socket qualification testing for its socket. Any additional

testing that is required due to design modifications will also be at the expense of the

supplier.

6.4. Socket Design Verification:

At the earliest possible date, a detailed drawing of the socket supplier's 423 Pin Socket

must be provided to Intel for review. This drawing should include all of the features

called out in this specification (marking, pinout, cam location, date code location and

explanation, etc.) as well as dimensional and board layout information. This drawing will

be used to confirm compliance to this specification.

6.5. Reporting:

Test reports of the socket qualification testing will be provided directly from the

independent test facility to Intel. Intel will also be given access to contact the test facility

directly to obtain socket qualification status, explanation of test results and

recommendations based on the test results.