Intel Pentium 4 Processor 423 Pin Socket (PGA423) Design Guidelines

423 Pin Socket Design Guidelines

6.6. Process Changes:

Any significant change to the socket will require submission of a detailed explanation of

the change at least 60 days prior to the planned implementation. Intel

will review the

modification and establish the necessary re-qualification procedure that the socket must

pass. Any testing that is required MUST be completed before the change is implemented.

Typical examples of significant changes include, but are not limited to, the following:

Plastic material changes including base material or color; contact changes including base

material, plating material or thickness; and design modifications.

6.7. Quality Assurance Requirements:

The OEM’s will work with the socket supplier(s) they choose to ensure socket quality.

6.8. Socket Test Plan:

6.8.1. Submission of a 423 Pin Socket for Socket Qualification Testing:

The socket supplier's 423 Pin Socket will be sent to Intel's designated third party

test house for socket qualification testing. The sockets submitted must be per the

drawing required in Section 6.4 and must be reviewed and approved (for

submittal) by Intel before the start of testing. Refer to Sections 6.10 and 6.11.1

for production lot definition and number of samples required for qualification

testing.

6.8.2. Test Flow:

The test flow is outlined in Section 6.10. Sample sizes and test requirements are

given for each test group. For specific test procedures, please refer to the

applicable test specifications referenced in Section 6.1.

6.8.3. Retest Restrictions:

Failures of particular sections of the test plan for a given socket footprint will

require re-testing of at least a portion of the test flow defined in Section 6.10. The

definition of the tests required will be at Intel's discretion. The modifications that

will be made to the socket to improve a failing condition must be provided to Intel

in writing and must be approved by Intel prior to retest. If failures occur after

retest, further testing will be at Intel's discretion.

6.8.4. Mechanical Samples:

A mechanical sample of the 423 Pin Socket, package substrate, and heat sink (or

suitable mockups that approximate size and mass of the planned heat sink) will be

used during the mated socket qualification testing. The recommended maximum

mass for the Intel

Pentium

4 processor package heat sink is 300g for socket

attach, and 450g for board retention mechanism. It is the suppliers responsibility