Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

Datasheet 13
Introduction
1.1.1 Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Intel
®
Pentium
®
4 processor Extreme Edition on 0.13 micron process in 775-land
package — Processor in the FC-LGA4 package with a 2 MB L3 cache and 512-KB L2 cache.
• Processor — For this document, the term processor is the generic form of the Pentium 4
processor Extreme Edition on 0.13 micron process in 775-land package.
• Keep-out zone — The area on or near the processor that system design cannot utilize.
• Intel
®
925X Express Chipset — Chipset that supports DDR2 memory technology for the
Pentium 4 processor Extreme Edition in the 775-land package.
• Processor core — Processor core die with Level 2 (L2) and Level 3 (L3) cache.
• FC-LGA4 package — The Pentium 4 processor Extreme Edition in the 775-land package is
available in a Flip-Chip Land Grid Array 4 package, consisting of a processor core mounted
on a substrate with an integrated heat spreader (IHS).
• LGA775 socket — The Pentium 4 processor Extreme Edition in the 775-land package mates
with the system board through a surface mount, 775-land, LGA socket.
• Hyper-Threading Technology — Hyper-Threading Technology allows a single, physical
Pentium 4 processor to function as two logical processors when the necessary system
ingredients are present. For more information, see: www.intel.com/info/hyperthreading.
• Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
• Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
• Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e. unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation—Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.