Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

Datasheet 3
Contents
1 Introduction.......................................................................................................................11
1.1 Terminology.........................................................................................................12
1.1.1 Processor Packaging Terminology.........................................................13
1.2 References..........................................................................................................14
2 Electrical Specifications....................................................................................................15
2.1 FSB and GTLREF0 .............................................................................................15
2.2 Power and Ground Lands ...................................................................................15
2.3 Decoupling Guidelines ........................................................................................15
2.3.1 Vcc Decoupling ......................................................................................16
2.3.2 FSB GTL+ Decoupling ...........................................................................16
2.4 Voltage Identification...........................................................................................16
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................17
2.5 Reserved, Unused, and TESTHI Signals............................................................17
2.6 FSB Signal Groups..............................................................................................18
2.7 GTL+ Asynchronous Signals...............................................................................20
2.8 Test Access Port (TAP) Connection....................................................................20
2.9 FSB Frequency Select Signals (BSEL[2:0])........................................................20
2.10 Absolute Maximum and Minimum Ratings..........................................................21
2.11 Processor DC Specifications...............................................................................22
2.12 V
CC
Overshoot Specification...............................................................................26
2.12.1 Die Voltage Validation............................................................................27
2.13 GTL+FSB Specifications .....................................................................................27
3 Package Mechanical Specifications.................................................................................29
3.1 Package Mechanical Drawing .............................................................................29
3.2 Processor Component Keep-Out Zones .............................................................32
3.3 Package Loading Specifications .........................................................................33
3.4 Package Handling Guidelines .............................................................................33
3.5 Package Insertion Specifications ........................................................................33
3.6 Processor Mass Specification .............................................................................34
3.7 Processor Materials.............................................................................................34
3.8 Processor Markings.............................................................................................34
3.9 Processor Land Coordinates...............................................................................35
4 Land Listing and Signal Descriptions ...............................................................................37
4.1 Processor Land Assignments..............................................................................37
4.2 Alphabetical Signals Reference ..........................................................................60
5 Thermal Specifications and Design Considerations.........................................................69
5.1 Processor Thermal Specifications.......................................................................69
5.1.1 Thermal Specifications...........................................................................69
5.1.2 Thermal Metrology .................................................................................70
5.2 Processor Thermal Features...............................................................................71
5.2.1 Thermal Monitor .....................................................................................71
5.2.2 On-Demand Mode..................................................................................71
5.2.3 PROCHOT# Signal ................................................................................72