Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

4 Datasheet
5.2.4 THERMTRIP# Signal .............................................................................72
5.2.5 Thermal Diode........................................................................................73
6 Features...........................................................................................................................75
6.1 Power-On Configuration Options ........................................................................ 75
6.2 Clock Control and Low Power States..................................................................75
6.2.1 Normal State—State 1 ...........................................................................75
6.2.2 AutoHALT Powerdown State—State 2 ..................................................76
6.2.3 Stop-Grant State—State 3 .....................................................................76
6.2.4 HALT/Grant Snoop State—State 4 ........................................................ 77
6.2.5 Sleep State—State 5.............................................................................. 77
7 Boxed Processor Specifications.......................................................................................79
7.1 Mechanical Specifications................................................................................... 80
7.1.1 Boxed Processor Cooling Solution Dimensions..................................... 80
7.1.2 Boxed Processor Fan Heatsink Weight..................................................82
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly .............................................................................82
7.2 Electrical Requirements ...................................................................................... 82
7.2.1 Fan Heatsink Power Supply...................................................................82
7.3 Thermal Specifications........................................................................................ 84
7.3.1 Boxed Processor Cooling Requirements ...............................................84
7.3.2 Variable Speed Fan ...............................................................................86
8 Debug Tools Specifications..............................................................................................89
8.1 Logic Analyzer Interface (LAI)............................................................................. 89
8.1.1 Mechanical Considerations ....................................................................89
8.1.2 Electrical Considerations........................................................................89