Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

70 Datasheet
Thermal Specifications and Design Considerations
5.1.2 Thermal Metrology
The maximum and minimum case temperatures (T
C
) are specified in Table 5-1. These temperature
specifications are meant to help ensure proper operation of the processor. Figure 5-1 illustrates
where Intel recommends T
C
thermal measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the Intel
®
Pentium
®
4 Processor Extreme Edition
on 0.13 Micron Process in the 775-land package Thermal Design Guide.
Table 5-1. Processor Thermal Specifications
Core Frequency (GHz)
Thermal Design
Power (W)
Minimum T
C
(°C)
Maximum T
C
(°C)
Notes
3.40 109.6 5 66
1, 2
NOTES:
1. These values are specified at V
cc_max
for the processor. Systems must be designed to ensure that
the processor is not subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
cc_max
at specified I
CC
. Refer to loadline specification in Chapter 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP
is not the maximum power that the processor can dissipate.
3.46 110.7 5 66
1, 2
Figure 5-1. Case Temperature (T
C
) Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm