Intel Pentium 4 Processor on 90 nm Process

Datasheet 3
Contents
1 Introduction..................................................................................................................9
1.1 Terminology.........................................................................................................10
1.1.1 Processor Packaging Terminology.........................................................10
1.2 References..........................................................................................................11
2 Electrical Specifications........................................................................................13
2.1 Power and Ground Pins ......................................................................................13
2.2 Decoupling Guidelines ........................................................................................13
2.2.1 V
CC
Decoupling ......................................................................................13
2.2.2 FSB GTL+ Decoupling ...........................................................................13
2.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................14
2.3 Voltage Identification...........................................................................................14
2.3.1 Phase Lock Loop (PLL) Power and Filter...............................................16
2.4 Reserved, Unused, and TESTHI Pins.................................................................17
2.5 FSB Signal Groups..............................................................................................18
2.6 Asynchronous GTL+ Signals...............................................................................19
2.7 Test Access Port (TAP) Connection....................................................................19
2.8 FSB Frequency Select Signals (BSEL[1:0])........................................................20
2.9 Absolute Maximum and Minimum Ratings..........................................................21
2.10 Processor DC Specifications...............................................................................21
2.11 V
CC
Overshoot Specification...............................................................................29
2.11.1 Die Voltage Validation............................................................................30
3 Package Mechanical Specifications.................................................................31
3.1 Package Mechanical Specifications ....................................................................31
3.1.1 Package Mechanical Drawing ................................................................32
3.1.2 Processor Component Keep-out Zones .................................................35
3.1.3 Package Loading Specifications ............................................................35
3.1.4 Package Handling Guidelines ................................................................35
3.1.5 Package Insertion Specifications ...........................................................36
3.1.6 Processor Mass Specification ................................................................36
3.1.7 Processor Materials................................................................................36
3.1.8 Processor Markings................................................................................36
3.1.9 Processor Pinout Coordinates................................................................37
4 Pin List and Signal Description..........................................................................39
4.1 Processor Pin Assignments ................................................................................39
4.2 Alphabetical Signals Reference ..........................................................................54
5 Thermal Specifications and Design Considerations.................................63
5.1 Processor Thermal Specifications.......................................................................63
5.1.1 Thermal Specifications...........................................................................63
5.1.2 Thermal Metrology .................................................................................66
5.2 Processor Thermal Features...............................................................................67
5.2.1 Thermal Monitor .....................................................................................67