Intel Pentium 4 Processor on 90 nm Process

Datasheet 31
Package Mechanical Specifications
3 Package Mechanical
Specifications
3.1 Package Mechanical Specifications
The Pentium 4 processor on 90 nm process is in a Flip-Chip Pin Grid Array (FC-mPGA4) package
that interfaces with the motherboard via a mPGA478B socket. The package consists of a processor
core mounted on a substrate pin-carrier. An integrated heat spreader (IHS) is attached to the
package substrate and core and serves as the mating surface for processor component thermal
solutions (such as a heatsink). Figure 5 shows a sketch of the processor package components and
how they are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C,
and mPGA476 Socket Design Guidelines for complete details on the mPGA478B socket.
The package components shown in Figure 5 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
Figure 5. Processor Package Assembly
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM