Intel Pentium 4 Processor on 90 nm Process

36 Datasheet

Package Mechanical Specifications

3.1.5 Package Insertion Specifications

The processor can be inserted into and removed from a mPGA478B socket 15 times. The socket

should meet the mPGA478B requirements detailed in the mPGA479, mPGA478A, mPGA478B,

mPGA478C, and mPGA476 Socket Design Guidelines.

3.1.6 Processor Mass Specification

The typical mass of the processor is 19 g [0.67 oz]. This mass [weight] includes all the components

that are included in the package.

3.1.7 Processor Materials

Table 22 lists some of the package components and associated materials.

3.1.8 Processor Markings

Figure 8 shows the topside markings on the processor. This diagram is intended to aid in the

identification of the processor.

Table 22. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Pins Gold Plated Copper

Figure 8. Processor Top-Side Markings

2-D Matrix Mark

m c

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SSPEC/Country of Assy

FPO

Product Code

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ATPO

Ser ial #

INTEL

PENTIUM® 4

X.XXGHZ / 1M / 800

SLXXX MALAY

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Brand