Assembling Intel Reference Components for the Intel Pentium 4 Processor in 478-Pin Package

4
mPGA478 Platforms Mechanical
Reference Solution Benefits
 This solution provides structural robustness to assure mechanical
and electrical integrity of the motherboard during shock and vibration
events(**) described in the Intel® Pentium® 4 Processor in the 478-
Pin Package Thermal Design Guidelines available on
http://www.developer.intel.com/design/pentium4
website .
 Motherboard stiffening to protect socket and chipset solder joints during
manufacturing and shipment
 Prevention of package pullout during shipment
 Assurance of thermal interface material performance
 This mechanism can be mounted entirely from the top side of the
board, and has no specific tool requirements
 Easier assembly on the manufacturing line (no need to work on the back on the
board, and/or on the chassis)
 Increased motherboard design flexibility also enabling chassis independent
solutions.
(**): Shock :50g, trapezoidal, 11ms duration
Vibration: 5Hz-350Hz, 3.13g RMS power spectral density, 10 minute duration