Intel Pentium 4 Processor 478-Pin Socket (mPGA478) Design Guidelines

Intel® Pentium® 4 Processor 478-Pin Socket (mPGA478)
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3.5. Material and Recycling Requirements
Cadmium shall not be used in the painting or plating of the socket.
CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component
exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines.
3.6. Socket Manufacturability Requirements
The mPGA478 Socket must be a surface mount socket design; double-sided reflow capability is not required.
3.7. Overall Assembly Sequence
1. Mount socket to motherboard using a surface mount process.
2. Place retention mechanism (if required) around socket and secure to motherboard.
3. Insert package into socket.
4. Actuate socket using lever.
5. Load heat sink onto package and secure.
3.8. Socket Engagement/Disengagement Force
The force on the actuation lever arm must not exceed 4.5Kg to engage or disengage the package into the 478
Pin Socket. Movement of the cover limited to the plane parallel to the motherboard. The processor package
must not be utilized in the actuation of the socket.
3.9. Visual Aids
The socket top will have markings identifying open and closed positions for the actuation lever arm.
The socket top will have markings identifying Pin 1. This marking will be represented by a symbol and/or
the socket will have a notched feature identifying Pin 1. Section 8 – Appendix Z.2 – identifies the location of
the Pin 1 identifying mark.
3.10. Equipment Pick and Place
The socket must be capable of being used in a high-volume manufacturing environment. A pick and place
solution is required with the following options recommended for vacuum pick and place: Flat cover attached
to socket, tape attached to socket, or addition of flat plastic on socket for vacuum cup pick up. The preferred
pick and place solution is to use the socket housing without added features.
3.11. Socket BGA Co-Planarity
203 mm coplanarity maximum over the entire ball field (this requirement includes all balls/surface mount
feature on the underside of the socket).