Intel Pentium 4 Processor 478-Pin Socket (mPGA478) Design Guidelines

Intel® Pentium® 4 Processor 478-Pin Socket (mPGA478)
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Contents
1.
Introduction .................................................................................................................................. 6
1.1. Objective.......................................................................................................................... 6
1.2. Purpose ........................................................................................................................... 6
1.3. Scope .............................................................................................................................. 6
2. Assembled Component and Package Description ...................................................................... 7
2.1. Assembled Component Description................................................................................ 7
2.2. Package Description ....................................................................................................... 7
3. Mechanical Requirements ........................................................................................................... 8
3.1. Mechanical Supports:...................................................................................................... 8
3.2. Materials.......................................................................................................................... 8
3.2.1. Socket Housing ............................................................................................. 8
3.2.2. Color 8
3.2.3. Cutouts For Package Removal ..................................................................... 8
3.2.4. Socket Standoff Height ................................................................................. 8
3.3. Markings.......................................................................................................................... 9
3.3.1. Name 9
3.3.2. Mechanical Keying Map and Markings For mPGA478 Sockets.................... 9
3.3.3. Lock (closed) and Unlock (open) Markings................................................. 10
3.3.4. Lot Traceability............................................................................................ 10
3.3.5. Socket Size ................................................................................................. 11
3.3.6. Socket / Package Translation during Actuation .......................................... 11
3.3.7. Orientation in Packaging ............................................................................. 11
3.4. Contact Characteristics ................................................................................................. 11
3.4.1. Number of Contacts .................................................................................... 11
3.4.2. Base Material .............................................................................................. 11
3.4.3. Contact Area Plating ................................................................................... 11
3.4.4. Solder Ball/Surface Mount Feature Characteristics .................................... 11
3.4.5. Lubricants.................................................................................................... 11
3.5. Material and Recycling Requirements........................................................................... 12
3.6. Socket Manufacturability Requirements........................................................................ 12
3.7. Overall Assembly Sequence ......................................................................................... 12
3.8. Socket Engagement/Disengagement Force ................................................................. 12
3.9. Visual Aids.....................................................................................................................12
3.10. Equipment Pick and Place ............................................................................................ 12
3.11. Socket BGA Co-Planarity.............................................................................................. 12
3.12. Solder Ball/Surface Mount Feature True Position ......................................................... 13
3.13. EMI Tab Socket Requirements ..................................................................................... 13
3.13.1. Tab Size ...................................................................................................... 13
3.13.2. Tab Shape................................................................................................... 13
3.14. Assembly Requirements to the Motherboard................................................................ 14
3.14.1. Surface Mountable ...................................................................................... 14
3.14.2. Reflow Characteristics................................................................................. 14
3.14.3. Shipping/Handling: ...................................................................................... 14
3.15. Critical To Function Dimensions:................................................................................... 14