Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

Datasheet 29
Package Mechanical Specifications
3 Package Mechanical
Specifications
The Pentium 4 processor Extreme Edition in the 775-land package is packaged in a Flip-Chip Land
Grid Array (FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The
package consists of a processor core mounted on a substrate land-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the
processor package components and how they are assembled together. Refer to the LGA775 Socket
Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in Figure 3-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings
include dimensions necessary to design a thermal solution for the processor. These dimensions
include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
All drawing dimensions are in mm [in].
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM