Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

32 Datasheet
Package Mechanical Specifications
3.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the
package substrate. See Figure 3-4 for keep-out zones.
The location and quantity of package capacitors may change due to manufacturing efficiencies but
will remain within the component keep-in.
Figure 3-4. Processor Package Drawing Sheet 3 of 3