Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

6 Datasheet
Tables
1-1 References..........................................................................................................14
2-1 Voltage Identification Definition...........................................................................16
2-2 FSB Signal Groups ............................................................................................. 19
2-3 BSEL[2:0] FSB Frequency Selections ................................................................20
2-4 Processor DC Absolute Maximum Ratings ......................................................... 21
2-5 Voltage and Current Specifications.....................................................................22
2-6 V
CC
Static and Transient Tolerance....................................................................23
2-7 GTL+ Signal Group DC Specifications................................................................24
2-8 Asynchronous GTL+ Signal Group DC Specifications........................................25
2-9 PWRGOOD and TAP Signal Group DC Specifications .....................................25
2-10 VTTPWRGD DC Specifications ..........................................................................26
2-11 BSEL [2:0] and VID[5:0] DC Specifications.........................................................26
2-12 V
CC
Overshoot Specifications.............................................................................26
2-13 GTL+ Bus Voltage Definitions.............................................................................28
3-1 Processor Loading Specifications ....................................................................... 33
3-2 Package Handling Guidelines .............................................................................33
3-3 Processor Materials ............................................................................................34
4-1 Alphabetical Land Assignments ..........................................................................40
4-2 Numerical Land Assignment ............................................................................... 50
4-3 Signal Description (Sheet 1 of 9) ........................................................................60
5-1 Processor Thermal Specifications.......................................................................70
5-2 Thermal Diode Parameters .................................................................................73
5-3 Thermal Diode Interface......................................................................................73
6-1 Power-On Configuration Option Signals ............................................................. 75
7-1 Fan Heatsink Power and Signal Specifications................................................... 83
7-2 Boxed Processor Fan Heatsink Set Points .........................................................87