Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

Datasheet 69

Thermal Specifications and Design Considerations

5 Thermal Specifications and

Design Considerations

5.1 Processor Thermal Specifications

The Pentium 4 processor Extreme Edition in the 775-land package requires a thermal solution to

maintain temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate

the processor outside these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes, thermal

management becomes increasingly crucial when building computer systems. Maintaining the

proper thermal environment is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks attached to the

processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of

system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel

Pentium

4 Processor Extreme Edition on 0.13 Micron Process in the 775-land package Thermal

Design Guide.

Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on

the boxed processor.

5.1.1 Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the

system/processor thermal solution should be designed such that the processor remains within the

minimum and maximum case temperature (T

) specifications when operating at or below the

Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not

designed to provide this level of thermal capability may affect the long-term reliability of the

processor and system. For more details on thermal solution design, refer to the appropriate

processor thermal design guidelines.

The case temperature is defined at the geometric top center of the processor. Analysis indicates that

real applications are unlikely to cause the processor to consume maximum power dissipation for

sustained periods of time. Intel recommends that complete thermal solution designs target the

Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power

consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely

event that an application exceeds the TDP recommendation for a sustained period of time. For

more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor

feature must be enabled for the processor to remain within specification.