Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package Datasheet

Datasheet 89
Debug Tools Specifications
8 Debug Tools Specifications
Refer to the ITP700 Debug Port Design Guide for information regarding debug tools
specifications. The ITP700 Debug Port Design Guide is located on http://developer.intel.com.
8.1 Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging Pentium 4 processor Extreme Edition in the 775-land package systems. Tektronix*
and Agilent* should be contacted to get specific information about their logic analyzer interfaces.
The following information is general. Specific information must be obtained from the logic
analyzer vendor.
Due to the complexity of Pentium 4 processor Extreme Edition in the 775-land package systems,
the LAI is critical in providing the ability to probe and capture FSB signals. There are two sets of
considerations to keep in mind when designing a Pentium 4 processor Extreme Edition in the 775-
land package system that can make use of an LAI: mechanical and electrical.
8.1.1 Mechanical Considerations
The LAI is installed between the processor socket and the Pentium 4 processor Extreme Edition in
the 775-land package. The LAI lands plug into the socket, while the Pentium 4 processor Extreme
Edition in the 775-land package lands plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the Pentium 4 processor Extreme
Edition in the 775-land package and a logic analyzer. The maximum volume occupied by the LAI,
known as the keep-out volume, as well as the cable egress restrictions, should be obtained from the
logic analyzer vendor. System designers must make sure that the keepout volume remains
unobstructed inside the system. Note that it is possible that the keepout volume reserved for the
LAI may differ from the space normally occupied by the Pentium 4 processor Extreme Edition in
the 775-land package heatsink. If this is the case, the logic analyzer vendor will provide a cooling
solution as part of the LAI.
8.1.2 Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to obtain
electrical load models from each of the logic analyzers to be able to run system level simulations to
prove that their tool will work in the system. Contact the logic analyzer vendor for electrical
specifications and load models for the LAI solution they provide.
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