Intel Pentium 4 Processor In the 423-pin Package Thermal Design Guidelines

Pentium® 4 processor in the 423-pin package Thermal Design Guidelines
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CONTENTS
1 INTRODUCTION -------------------------------------------------------------------------------------------------------------------------------------------------6
1.1 Document Goals ----------------------------------------------------------------------------------------------------------------------------------------------- 6
1.2 Document Scope ---------------------------------------------------------------------------------------------------------------------------------------------- 6
1.3 References ------------------------------------------------------------------------------------------------------------------------------------------------------ 6
1.4 Definition of Terms -------------------------------------------------------------------------------------------------------------------------------------------- 6
1.5 Revision History------------------------------------------------------------------------------------------------------------------------------------------------ 7
2 IMPORTANCE OF THERMAL MANAGEMENT--------------------------------------------------------------------------------------------------------- 8
3 PENTIUM 4 PROCESSOR PACKAGING TECHNOLOGY------------------------------------------------------------------------------------------- 8
4 THERMAL SPECIFICATIONS--------------------------------------------------------------------------------------------------------------------------------9
4.1 Assumptions ---------------------------------------------------------------------------------------------------------------------------------------------------- 9
4.2 Processor Case Temperature------------------------------------------------------------------------------------------------------------------------------ 9
4.3 Processor Power----------------------------------------------------------------------------------------------------------------------------------------------- 9
5 DESIGNING FOR THERMAL PERFORMANCE ------------------------------------------------------------------------------------------------------ 10
5.1 Airflow Management---------------------------------------------------------------------------------------------------------------------------------------- 10
5.2 Bypass---------------------------------------------------------------------------------------------------------------------------------------------------------- 10
5.3 Heat Sink Solutions ----------------------------------------------------------------------------------------------------------------------------------------- 11
5.4 Pentium 4 processor Reference Heat Sink ----------------------------------------------------------------------------------------------------------- 11
5.4.1 Heat Sink Weight-------------------------------------------------------------------------------------------------------------------------------------- 11
5.4.2 Altitude --------------------------------------------------------------------------------------------------------------------------------------------------- 11
5.4.3 Heat Sink Mechanical Envelope------------------------------------------------------------------------------------------------------------------- 11
5.5 Thermal Interface Management ------------------------------------------------------------------------------------------------------------------------- 14
5.5.1 Bond Line Management ----------------------------------------------------------------------------------------------------------------------------- 14
5.5.2 Interface Material Area------------------------------------------------------------------------------------------------------------------------------- 14
5.5.3 Interface Material Performance-------------------------------------------------------------------------------------------------------------------- 14
5.6 Fans------------------------------------------------------------------------------------------------------------------------------------------------------------- 15
5.6.1 Placement ----------------------------------------------------------------------------------------------------------------------------------------------- 15
5.6.2 Direction ------------------------------------------------------------------------------------------------------------------------------------------------- 16
5.6.3 Size And Quantity ------------------------------------------------------------------------------------------------------------------------------------- 16
5.6.4 Venting --------------------------------------------------------------------------------------------------------------------------------------------------- 16
6 ALTERNATIVE COOLING SOLUTIONS---------------------------------------------------------------------------------------------------------------- 17
6.1 Ducting --------------------------------------------------------------------------------------------------------------------------------------------------------- 17
6.1.1 Ducting Placement------------------------------------------------------------------------------------------------------------------------------------ 17
6.2 System Components --------------------------------------------------------------------------------------------------------------------------------------- 17
6.2.1 Placement ----------------------------------------------------------------------------------------------------------------------------------------------- 17
6.2.2 Power----------------------------------------------------------------------------------------------------------------------------------------------------- 17
6.2.3 Voltage Regulation Module (VRM) Considerations ------------------------------------------------------------------------------------------ 17
7 THERMAL METROLOGY ----------------------------------------------------------------------------------------------------------------------------------- 17
7.1 Thermal Metrology for Pentium® 4 processors------------------------------------------------------------------------------------------------------ 18
7.1.1 Thermal Resistance ---------------------------------------------------------------------------------------------------------------------------------- 18
7.1.2 Thermal Solution Performance -------------------------------------------------------------------------------------------------------------------- 19
7.1.3 Local Ambient Temperature Measurement Guidelines ------------------------------------------------------------------------------------- 19
7.1.4 Measurements for Processor Thermal Specifications--------------------------------------------------------------------------------------- 20
7.2 Thermal Test Vehicle –to- CPU Thermal Performance Correction Factor
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8 THERMAL MANAGEMENT LOGIC AND THERMAL MONITOR FEATURE ----------------------------------------------------------------- 22
8.1 Processor Power Dissipation----------------------------------------------------------------------------------------------------------------------------- 22
8.2 Thermal Monitor Implementation ------------------------------------------------------------------------------------------------------------------------ 23
8.3 Operation and Configuration ----------------------------------------------------------------------------------------------------------------------------- 24
8.4 System Considerations ------------------------------------------------------------------------------------------------------------------------------------ 25