Intel Pentium 4 Processor In the 423-pin Package Thermal Design Guidelines

Pentium® 4 processor in the 423-pin package Thermal Design Guidelines
8
2 IMPORTANCE OF THERMAL MANAGEMENT
The objective of thermal management is to ensure that the temperatures of all components in a system are
maintained within functional limits. The functional temperature limit is the range within which the electrical circuits
can be expected to meet their specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors or cause component and/or system damage. Temperatures exceeding
the maximum operating limits may result in irreversible changes in the operating characteristics of the component.
3 PENTIUM 4 PROCESSOR PACKAGING TECHNOLOGY
The Pentium® 4 processor is available in Pin Grid Array (PGA) packaging. The Integrated Heat Spreader (IHS) is
the interface between the processor silicon and a heat sink. The processor connects to the motherboard through a ZIF
through-hole socket. A description of the socket can be found in the
423 Pin Socket (PGA423) Design Guidelines
.
Package dimensions of the Pentium 4 processor are shown in Figure 1.
Figure 1. Pentium 4 processor package dimensions
Note: In case of conflicts in dimensions the processor datasheet supercedes this document.
All dimensions are in inches
()
.515 1.220
.192
±
.019 WC
±
.009 RSS
1.220
(2.100)
.465
Pin 1
1.063
.079
1.063
.079