Intel Pentium 4 Processor in the 423-pin Package Thermal Solution Functional Specification

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Intel® Pentium® 4 Processor Thermal Solution Functional Specification
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Intel Reference Designs for Enabled Components
The Intel reference design is composed of a copper base, aluminum folded fin active heat sink with
Shin-Etsu* G749 as the thermal interface material. To ensure proper seating and spring force of the
Intel reference design heat sink clip, the vertical stack-up of the socket and package is 0.407in +/-
0.016in, and the thermal interface material thickness was assumed to be a maximum of 0.005in after
assembly. The thermal interface material for the reference design must be pre-applied at the factory.
The Intel reference design heat sink clip will apply a pressure on the thermal interface material between
5psi and 16psi.
The heat sink clip must be designed in a way that minimizes contact with the motherboard surface
during clip attach to the Retention Mechanism (RM) tab features; the clip should not scrape and/or
scratch the motherboard. All surfaces of the clip should be free of sharp edges to prevent injury to any
system component or to the person performing the installation. The force required to complete clip
attachment (during clip engagement to the RM) should not exceed 6lbf per clip. The clip window
should engage the side tab first, then attach one end tab followed by the last end tab.
The following figures present the Intel reference design for the heat sink clip and the retention
mechanism. Contact your local Intel sales representative for the full models in either Pro Engineer* or
IGES format.