Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
18 Design Guide
In addition to passive heatsinks, fan heatsinks and system fans, other solutions exist for cooling
integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all
capable of dissipating additional heat. Due to their varying attributes, each of these solutions may
be appropriate for a particular system implementation.
To develop a reliable, cost-effective thermal solution, thermal characterization and simulation
should be carried out at the entire system level, accounting for the thermal requirements of each
component. In addition, acoustic noise constraints may limit the size, number, placement, and
types of fans that can be used in a particular design.
To ease the burden on cooling solutions the Thermal Monitor feature and associated logic have
been integrated into the silicon of the Intel
®
Pentium
®
4 processor in the 478-pin package. By
taking advantage of the Thermal Monitor feature, system designers may reduce the cooling system
cost while maintaining the processor reliability and performance goals. Implementation options
and recommendations are described in Section 2.4.