Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
Design Guide 3
Contents
1 Introduction..........................................................................................................................7
1.1 References..............................................................................................................9
1.2 Definition of Terms..................................................................................................9
2 Thermal Mechanical Information .......................................................................................11
2.1 Mechanical Requirements ....................................................................................11
2.1.1 Processor Package ...............................................................................11
2.1.2 Heatsink Attach .....................................................................................12
2.2 Thermal Specifications .........................................................................................13
2.2.1 Processor Case Temperature and Power Dissipation ..........................13
2.2.2 Designing a Cooling Solution for the Intel
®
Pentium
®
4 Processor in the
478-Pin Package...................................................................................13
2.2.2.1 Heatsink Solutions ...............................................................13
2.2.2.1.1 Heatsink Design Considerations..........................13
2.2.2.1.2 Thermal Interface Material...................................15
2.2.2.1.3 Summary..............................................................15
2.2.2.2 Characterizing Cooling Performance Requirements ...........15
2.2.2.3 Example...............................................................................17
2.2.2.4 Looking at the Whole Thermal Solution...............................17
2.3 Thermal Metrology for the Intel
®
Pentium
®
4 Processor in the 478-Pin Package.19
2.3.1 Processor Cooling Solution Performance Assessment.........................19
2.3.2 Local Ambient Temperature Measurement Guidelines.........................19
2.3.3 Processor Case Temperature Measurement Guidelines......................21
2.3.3.1 Thermocouple Attachment...................................................21
2.3.3.2 Heatsink Preparation – Rectangular (Cartesian) Geometry 24
2.3.3.3 Heatsink Preparation – Radial (Cylindrical) geometry .........25
2.3.3.4 Thermal Measurement.........................................................25
2.3.4 Thermal Test Vehicle Information .........................................................26
2.3.4.1 Thermal Test Die .................................................................26
2.3.4.2 Connections .........................................................................26
2.3.4.3 Thermal Measurements.......................................................27
2.3.4.4 TTV Correction Factor to the Intel
®
Pentium
®
4 Processor in
the 478-Pin Package............................................................28
2.4 Thermal Management Logic and Thermal Monitor Feature .................................29
2.4.1 Processor Power Dissipation ................................................................29
2.4.2 Thermal Monitor Implementation ..........................................................30
2.4.3 Operation and Configuration .................................................................32
2.4.4 System Considerations .........................................................................33
2.4.5 Operating System and Application Software Considerations................34
2.4.6 Legacy Thermal Management Capabilities ...........................................34
2.4.6.1 Thermal Diode .....................................................................34
2.4.6.2 THERMTRIP#......................................................................35
2.4.6.3 Thermal Measurement Correlation......................................35
2.4.7 Cooling System Failure Warning...........................................................35
3 Critical to Function Dimensions of Intel Reference Cooling Solution ................................37