Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
Design Guide 39
3.1.3 Structural Reliability of Thermal Solution Assembly
Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given
thermal solution in assembled state. The thermal solution should be capable of sustaining thermal
performance after these tests are conducted; however, the conditions of the tests outlined here may
differ from your own system requirements.
3.1.3.1 Test Sequence
Each test sequence should start with components (i.e. motherboard, heatsink assembly, etc.) that
have never been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/CPU/Memory test (refer to section 3.1.3.5 below). The stress test should be then followed
by a visual inspection and then BIOS/CPU/Memory test.
3.1.3.2 Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
Figure 14. Random Vibration PSD
0.001
0.01
0.1
1 10 100 1000
Frequency (Hz)
PSD (g^2/Hz)
3.13GRMS (10 minutes per axis)
5 Hz
500 Hz
(5, 0.01)
(20, 0.02)
(500, 0.02)