Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
4 Design Guide
3.1
Intel Validation Criteria for the Reference Design.................................................37
3.1.1 Heatsink Performance...........................................................................37
3.1.1.1 Reference Heatsink Performance Target ............................37
3.1.1.2 Altitude .................................................................................37
3.1.1.3 Reference Heatsink Thermal Validation ..............................38
3.1.2 Fan Performance for Active Heatsink Thermal Solution .......................38
3.1.3 Structural Reliability of Thermal Solution Assembly..............................39
3.1.3.1 Test Sequence.....................................................................39
3.1.3.2 Random Vibration Test Procedure.......................................39
3.1.3.3 Shock Test Procedure .........................................................40
3.1.3.4 Post-Test Pass Criteria........................................................40
3.1.3.5 Recommended BIOS/CPU/Memory Test Procedures.........41
3.1.4 Material and Recycling Requirements...................................................41
3.1.5 Safety Requirements.............................................................................42
3.2 Enabling Component Mechanical Envelope .........................................................43
3.3 Reference Solution for the Intel
®
Pentium
®
4 Processor in the 478-Pin Package 47
3.3.1 Components ..........................................................................................47
3.3.2 Heatsink Mechanical Design Guidelines ...............................................48
3.3.3 Reference Heatsink Attach Clip Information .........................................50
3.3.4 Thermal Interface Material ....................................................................50
3.3.5 Intel Reference Mechanical Solution Component Drawings .................50
4 Conclusion.........................................................................................................................51
Appendix A: Thermal Interface Management ...........................................................................................53
Appendix B: Mechanical Drawings............................................................................................................55