Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
40 Design Guide
3.1.3.3 Shock Test Procedure
Recommended performance requirement for a motherboard:
• Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in./sec minimum velocity change.
• Setup: Mount sample board on test fixture.
Figure 15. Shock Acceleration Curve
0
10
20
30
40
50
60
0 2 4 6 8 10 12
Time
(
milli-seconds
)
A
c
c
e
l
e
r
a
t
i
o
n
(g)
3.1.3.4 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the retention mechanism windows, including any indication
of shearing, cracks in the retention mechanism body, or evidence of significant clip lever
penetration into the fan shroud.
2. Clip must remain latched to retention mechanism windows.
3. Heatsink remains seated and its bottom remains mated flatly against processor die surface. No
visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with
respect to the retention mechanism.
4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink
attach clip.
5. No visible physical damage to the processor package.
6. Successful BIOS/Processor/memory test of post-test samples.
7. Thermal compliance testing to demonstrate that the case temperature specification can be met.